Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection.
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| Title: | Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection. |
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| Authors: | Baïri, Abderrahmane1 (AUTHOR) abairi@u-paris10.fr, Haddad, Oriana1 (AUTHOR), Guinart, Jean-Pascal1 (AUTHOR), Adeyeye, Kemi2 (AUTHOR), Alilat, Nacim1 (AUTHOR) |
| Source: | Heat Transfer Engineering. 2018, Vol. 39 Issue 4, p353-358. 6p. 1 Diagram, 4 Graphs. |
| Subjects: | Electronics packaging, Free convection, Plastic embedment of electronic equipment, Thermal conductivity, Heat transfer |
| Abstract: | The junction temperature of the quad flat no-lead with 16 and 32 leads (QFN16 and QFN32) electronic packages subjected to free convection is highly affected by their encapsulating resin's thermal conductivity. This study considers a variation of this conductivity between −80% and +100% of the average value measured on an industrial prototype by means of the Transient Plane Source method. The three dimensional numerical solution based on the control volume formulation shows that the thermal trend is of exponential type for these components but with different functions. The proposed relationships allow the calculation of the junction temperature of both QFN16 and QFN32 according to the power generated varying between 0.1 and 1W, and the inclinations relative to the horizontal plane in the range 0–90° (horizontal and vertical positions respectively). The law governing the influence of conductivity on the junction temperature shows that a more conductive resin does not significantly lower the junction temperature. However, for low conductivity values, the temperature can exceed the maximum recommended by the manufacturers, causing possible malfunction of the QFN and altering its technical performance that are directly related to its thermal state. In some cases, the device can be decommissioned. [ABSTRACT FROM PUBLISHER] |
| Copyright of Heat Transfer Engineering is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 127184951 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Baïri%2C+Abderrahmane%22">Baïri, Abderrahmane</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> abairi@u-paris10.fr</i><br /><searchLink fieldCode="AR" term="%22Haddad%2C+Oriana%22">Haddad, Oriana</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Guinart%2C+Jean-Pascal%22">Guinart, Jean-Pascal</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Adeyeye%2C+Kemi%22">Adeyeye, Kemi</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Alilat%2C+Nacim%22">Alilat, Nacim</searchLink><relatesTo>1</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Heat+Transfer+Engineering%22">Heat Transfer Engineering</searchLink>. 2018, Vol. 39 Issue 4, p353-358. 6p. 1 Diagram, 4 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Free+convection%22">Free convection</searchLink><br /><searchLink fieldCode="DE" term="%22Plastic+embedment+of+electronic+equipment%22">Plastic embedment of electronic equipment</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+transfer%22">Heat transfer</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The junction temperature of the quad flat no-lead with 16 and 32 leads (QFN16 and QFN32) electronic packages subjected to free convection is highly affected by their encapsulating resin's thermal conductivity. This study considers a variation of this conductivity between −80% and +100% of the average value measured on an industrial prototype by means of the Transient Plane Source method. The three dimensional numerical solution based on the control volume formulation shows that the thermal trend is of exponential type for these components but with different functions. The proposed relationships allow the calculation of the junction temperature of both QFN16 and QFN32 according to the power generated varying between 0.1 and 1W, and the inclinations relative to the horizontal plane in the range 0–90° (horizontal and vertical positions respectively). The law governing the influence of conductivity on the junction temperature shows that a more conductive resin does not significantly lower the junction temperature. However, for low conductivity values, the temperature can exceed the maximum recommended by the manufacturers, causing possible malfunction of the QFN and altering its technical performance that are directly related to its thermal state. In some cases, the device can be decommissioned. [ABSTRACT FROM PUBLISHER] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Heat Transfer Engineering is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1080/01457632.2017.1305834 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 353 Subjects: – SubjectFull: Electronics packaging Type: general – SubjectFull: Free convection Type: general – SubjectFull: Plastic embedment of electronic equipment Type: general – SubjectFull: Thermal conductivity Type: general – SubjectFull: Heat transfer Type: general Titles: – TitleFull: Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Baïri, Abderrahmane – PersonEntity: Name: NameFull: Haddad, Oriana – PersonEntity: Name: NameFull: Guinart, Jean-Pascal – PersonEntity: Name: NameFull: Adeyeye, Kemi – PersonEntity: Name: NameFull: Alilat, Nacim IsPartOfRelationships: – BibEntity: Dates: – D: 15 M: 02 Text: 2018 Type: published Y: 2018 Identifiers: – Type: issn-print Value: 01457632 Numbering: – Type: volume Value: 39 – Type: issue Value: 4 Titles: – TitleFull: Heat Transfer Engineering Type: main |
| ResultId | 1 |
