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Packaging Solution for a Millimeter-Wave System-on-Chip Radar.

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Title: Packaging Solution for a Millimeter-Wave System-on-Chip Radar.
Authors: Goettel, Benjamin1, Winkler, Wolfgang2, Bhutani, Akanksha1, Boes, Florian1, Pauli, Mario1, Zwick, Thomas1
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. Jan2018, Vol. 8 Issue 1, p73-81. 9p.
Subjects: Electronics packaging, Integrated circuits, Simulation methods & models, Printed circuit design, Radio transmitter-receivers
Abstract: In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a standard printed circuit board (PCB). The electrical and thermal properties of the package are investigated through simulations and calibrated measurements. The concept is verified by realizing a complete radar sensor. The manufactured SoC radar frontend is soldered on a standard PCB which includes the baseband circuitry for a frequency-modulated continuous wave radar and finally, measurements are performed to compare the superposed radiation patterns of the transmit and receive antennas with simulations. [ABSTRACT FROM AUTHOR]
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Database: Engineering Source
Description
Abstract:In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a standard printed circuit board (PCB). The electrical and thermal properties of the package are investigated through simulations and calibrated measurements. The concept is verified by realizing a complete radar sensor. The manufactured SoC radar frontend is soldered on a standard PCB which includes the baseband circuitry for a frequency-modulated continuous wave radar and finally, measurements are performed to compare the superposed radiation patterns of the transmit and receive antennas with simulations. [ABSTRACT FROM AUTHOR]
ISSN:21563950
DOI:10.1109/TCPMT.2017.2758725