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Packaging Solution for a Millimeter-Wave System-on-Chip Radar.

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Title: Packaging Solution for a Millimeter-Wave System-on-Chip Radar.
Authors: Goettel, Benjamin1, Winkler, Wolfgang2, Bhutani, Akanksha1, Boes, Florian1, Pauli, Mario1, Zwick, Thomas1
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. Jan2018, Vol. 8 Issue 1, p73-81. 9p.
Subjects: Electronics packaging, Integrated circuits, Simulation methods & models, Printed circuit design, Radio transmitter-receivers
Abstract: In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a standard printed circuit board (PCB). The electrical and thermal properties of the package are investigated through simulations and calibrated measurements. The concept is verified by realizing a complete radar sensor. The manufactured SoC radar frontend is soldered on a standard PCB which includes the baseband circuitry for a frequency-modulated continuous wave radar and finally, measurements are performed to compare the superposed radiation patterns of the transmit and receive antennas with simulations. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 127408905
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Packaging Solution for a Millimeter-Wave System-on-Chip Radar.
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  Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+methods+%26+models%22">Simulation methods & models</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuit+design%22">Printed circuit design</searchLink><br /><searchLink fieldCode="DE" term="%22Radio+transmitter-receivers%22">Radio transmitter-receivers</searchLink>
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  Label: Abstract
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  Data: In this paper, a packaging solution for millimeter-wave system-on-chip (SoC) radio transceivers is presented. The on-chip antennas are realized as primary radiators of an integrated lens antenna which offer high bandwidth and high efficiency. The package concept includes a high permittivity silicon lens which serves additionally as heat sink and a quad flat no-lead package which is mountable on a standard printed circuit board (PCB). The electrical and thermal properties of the package are investigated through simulations and calibrated measurements. The concept is verified by realizing a complete radar sensor. The manufactured SoC radar frontend is soldered on a standard PCB which includes the baseband circuitry for a frequency-modulated continuous wave radar and finally, measurements are performed to compare the superposed radiation patterns of the transmit and receive antennas with simulations. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1109/TCPMT.2017.2758725
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      – Code: eng
        Text: English
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      – SubjectFull: Integrated circuits
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      – SubjectFull: Simulation methods & models
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      – SubjectFull: Printed circuit design
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      – SubjectFull: Radio transmitter-receivers
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              Text: Jan2018
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