APA (7th ed.) Citation

Ding, Y., Chu, C., & Mak, W. (2018). Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration. IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, 37(3), 657. https://doi.org/10.1109/TCAD.2017.2712660

Chicago Style (17th ed.) Citation

Ding, Yixiao, Chris Chu, and Wai-Kei Mak. "Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration." IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems 37, no. 3 (2018): 657. https://doi.org/10.1109/TCAD.2017.2712660.

MLA (9th ed.) Citation

Ding, Yixiao, et al. "Self-Aligned Double Patterning-Aware Detailed Routing With Double Via Insertion and Via Manufacturability Consideration." IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems, vol. 37, no. 3, 2018, p. 657, https://doi.org/10.1109/TCAD.2017.2712660.