Thermal Aware Test Scheduling for NTV Circuit.

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Title: Thermal Aware Test Scheduling for NTV Circuit.
Authors: Lim, Jaeil1, Oh, Hyunggoy1, Kim, Heetae1, Kang, Sungho1
Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems. Apr2018, Vol. 37 Issue 4, p906-910. 5p.
Subjects: Threshold voltage measurement, Systems on a chip testing, Energy consumption, Electric circuits, Simulation methods & models
Abstract: Although the near threshold voltage (NTV) design has achieved energy efficiency, certain challenges remain regarding its application. In this paper, we describe the analysis of thermally induced reliability concern in test process. In an NTV environment, the thermal dependency of a circuit delay is changed, and a difference in thermal constraints from that in a nominal voltage design exists. In addition, we propose a new test scheduling method for NTV circuits that alleviates the thermal constraints in system-on-chip test processes. Our simulation results show that the test time could be reduced while minimizing the reliability loss. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: <searchLink fieldCode="AR" term="%22Lim%2C+Jaeil%22">Lim, Jaeil</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Oh%2C+Hyunggoy%22">Oh, Hyunggoy</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kim%2C+Heetae%22">Kim, Heetae</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Kang%2C+Sungho%22">Kang, Sungho</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="DE" term="%22Threshold+voltage+measurement%22">Threshold voltage measurement</searchLink><br /><searchLink fieldCode="DE" term="%22Systems+on+a+chip+testing%22">Systems on a chip testing</searchLink><br /><searchLink fieldCode="DE" term="%22Energy+consumption%22">Energy consumption</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+circuits%22">Electric circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Simulation+methods+%26+models%22">Simulation methods & models</searchLink>
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  Data: Although the near threshold voltage (NTV) design has achieved energy efficiency, certain challenges remain regarding its application. In this paper, we describe the analysis of thermally induced reliability concern in test process. In an NTV environment, the thermal dependency of a circuit delay is changed, and a difference in thermal constraints from that in a nominal voltage design exists. In addition, we propose a new test scheduling method for NTV circuits that alleviates the thermal constraints in system-on-chip test processes. Our simulation results show that the test time could be reduced while minimizing the reliability loss. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1109/TCAD.2017.2729282
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      – Code: eng
        Text: English
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        PageCount: 5
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      – SubjectFull: Threshold voltage measurement
        Type: general
      – SubjectFull: Systems on a chip testing
        Type: general
      – SubjectFull: Energy consumption
        Type: general
      – SubjectFull: Electric circuits
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      – SubjectFull: Simulation methods & models
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      – TitleFull: Thermal Aware Test Scheduling for NTV Circuit.
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              M: 04
              Text: Apr2018
              Type: published
              Y: 2018
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