Hong, S. W., Duong, X. Q., Chung, J. D., & Kwon, O. K. (2018). Reassessment on the application of the embossed plate heat exchanger to adsorption chiller. Journal of Mechanical Science & Technology, 32(3), 1431. https://doi.org/10.1007/s12206-018-0247-0
Chicago Style (17th ed.) CitationHong, S. W., X. Q. Duong, J. D. Chung, and O. K. Kwon. "Reassessment on the Application of the Embossed Plate Heat Exchanger to Adsorption Chiller." Journal of Mechanical Science & Technology 32, no. 3 (2018): 1431. https://doi.org/10.1007/s12206-018-0247-0.
MLA (9th ed.) CitationHong, S. W., et al. "Reassessment on the Application of the Embossed Plate Heat Exchanger to Adsorption Chiller." Journal of Mechanical Science & Technology, vol. 32, no. 3, 2018, p. 1431, https://doi.org/10.1007/s12206-018-0247-0.