Reassessment on the application of the embossed plate heat exchanger to adsorption chiller.

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Title: Reassessment on the application of the embossed plate heat exchanger to adsorption chiller.
Authors: Hong, S. W.1,2, Duong, X. Q.1, Chung, J. D.1 jdchung@sejong.ac.kr, Kwon, O. K.3
Source: Journal of Mechanical Science & Technology. Mar2018, Vol. 32 Issue 3, p1431-1436. 6p.
Subjects: Heat exchangers, Embossing (Metalwork), Adsorption (Chemistry), Cooling systems, Heat flux
Abstract: In the authors’ previous work, an embossed plate heat exchanger was proposed to the adsorption bed and results showed that the plate heat exchanger adsorption chiller had a lower Coefficient of performance (COP) but higher Specific cooling power (SCP) than those of a fin-tube type adsorption chiller, which shows high potential to resolve one of the most serious disadvantages of the adsorption cooling system, i.e., system size. However, only one section of the repeating embossed pitch plate was used and a uniform inlet flow condition was applied, which might have caused a distortion in estimated performance. We have reassessed the embossed plate heat exchanger adsorption bed by including the end effect to examine the real benefit of the proposed heat exchanger. The result showed that SCP was not significantly changed, while a 66.4 % increase in COP was observed. The proposed embossed plate heat exchanger adsorption bed is expected to provide advantages in both COP and SCP compared to a fin-tube type adsorption bed. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Mechanical Science & Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Reassessment on the application of the embossed plate heat exchanger to adsorption chiller.
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  Data: <searchLink fieldCode="DE" term="%22Heat+exchangers%22">Heat exchangers</searchLink><br /><searchLink fieldCode="DE" term="%22Embossing+%28Metalwork%29%22">Embossing (Metalwork)</searchLink><br /><searchLink fieldCode="DE" term="%22Adsorption+%28Chemistry%29%22">Adsorption (Chemistry)</searchLink><br /><searchLink fieldCode="DE" term="%22Cooling+systems%22">Cooling systems</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+flux%22">Heat flux</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: In the authors’ previous work, an embossed plate heat exchanger was proposed to the adsorption bed and results showed that the plate heat exchanger adsorption chiller had a lower Coefficient of performance (COP) but higher Specific cooling power (SCP) than those of a fin-tube type adsorption chiller, which shows high potential to resolve one of the most serious disadvantages of the adsorption cooling system, i.e., system size. However, only one section of the repeating embossed pitch plate was used and a uniform inlet flow condition was applied, which might have caused a distortion in estimated performance. We have reassessed the embossed plate heat exchanger adsorption bed by including the end effect to examine the real benefit of the proposed heat exchanger. The result showed that SCP was not significantly changed, while a 66.4 % increase in COP was observed. The proposed embossed plate heat exchanger adsorption bed is expected to provide advantages in both COP and SCP compared to a fin-tube type adsorption bed. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: <i>Copyright of Journal of Mechanical Science & Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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        Value: 10.1007/s12206-018-0247-0
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 1431
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      – SubjectFull: Heat exchangers
        Type: general
      – SubjectFull: Embossing (Metalwork)
        Type: general
      – SubjectFull: Adsorption (Chemistry)
        Type: general
      – SubjectFull: Cooling systems
        Type: general
      – SubjectFull: Heat flux
        Type: general
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      – TitleFull: Reassessment on the application of the embossed plate heat exchanger to adsorption chiller.
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            NameFull: Hong, S. W.
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            NameFull: Duong, X. Q.
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            NameFull: Chung, J. D.
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            NameFull: Kwon, O. K.
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              M: 03
              Text: Mar2018
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              Y: 2018
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