Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies.
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| Title: | Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies. |
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| Authors: | Samavatian, Majid1, Ilyashenko, Lubov K.2, Surendar, A.3, Maseleno, Andino4, Samavatian, Vahid5 v.samavatian@gmail.com |
| Source: | Journal of Electronic Materials. Nov2018, Vol. 47 Issue 11, p6781-6790. 10p. 4 Diagrams, 3 Charts, 7 Graphs. |
| Subjects: | Solder joints, Ball grid array technology, Fatigue life, Electronic packaging, Vibration (Mechanics) |
| Abstract: | Fatigue life predictions for ball grid arrays (BGA) in electronic devices under random vibration have been made using the finite element method (FEM). Three different circuit board configurations were investigated to determine the best system design for longer fatigue lifetime. Moreover, to reveal the effect of the input frequency, different acceleration power spectral density (PSD) values were applied to the systems. The root-mean-square peeling stress was selected as the failure indicator. FEM results showed that the maximum peeling stress occurred at the outermost corners of solder joints adjacent to the printed circuit board in BGA packages. It was also found that, with increase in the input PSD, solder joints in BGA packages were more exposed to failure. Furthermore, it was revealed that the location of different parts of the system on the board can influence the stress distribution. The results show that a system with a heat sink at the corner of the board, away from the BGA packages, showed the longest fatigue life among the designed configurations. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 131948512 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Samavatian%2C+Majid%22">Samavatian, Majid</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Ilyashenko%2C+Lubov+K%2E%22">Ilyashenko, Lubov K.</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Surendar%2C+A%2E%22">Surendar, A.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AR" term="%22Maseleno%2C+Andino%22">Maseleno, Andino</searchLink><relatesTo>4</relatesTo><br /><searchLink fieldCode="AR" term="%22Samavatian%2C+Vahid%22">Samavatian, Vahid</searchLink><relatesTo>5</relatesTo><i> v.samavatian@gmail.com</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. Nov2018, Vol. 47 Issue 11, p6781-6790. 10p. 4 Diagrams, 3 Charts, 7 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Fatigue+life%22">Fatigue life</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Vibration+%28Mechanics%29%22">Vibration (Mechanics)</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Fatigue life predictions for ball grid arrays (BGA) in electronic devices under random vibration have been made using the finite element method (FEM). Three different circuit board configurations were investigated to determine the best system design for longer fatigue lifetime. Moreover, to reveal the effect of the input frequency, different acceleration power spectral density (PSD) values were applied to the systems. The root-mean-square peeling stress was selected as the failure indicator. FEM results showed that the maximum peeling stress occurred at the outermost corners of solder joints adjacent to the printed circuit board in BGA packages. It was also found that, with increase in the input PSD, solder joints in BGA packages were more exposed to failure. Furthermore, it was revealed that the location of different parts of the system on the board can influence the stress distribution. The results show that a system with a heat sink at the corner of the board, away from the BGA packages, showed the longest fatigue life among the designed configurations. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-018-6600-3 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 10 StartPage: 6781 Subjects: – SubjectFull: Solder joints Type: general – SubjectFull: Ball grid array technology Type: general – SubjectFull: Fatigue life Type: general – SubjectFull: Electronic packaging Type: general – SubjectFull: Vibration (Mechanics) Type: general Titles: – TitleFull: Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Samavatian, Majid – PersonEntity: Name: NameFull: Ilyashenko, Lubov K. – PersonEntity: Name: NameFull: Surendar, A. – PersonEntity: Name: NameFull: Maseleno, Andino – PersonEntity: Name: NameFull: Samavatian, Vahid IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 11 Text: Nov2018 Type: published Y: 2018 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 47 – Type: issue Value: 11 Titles: – TitleFull: Journal of Electronic Materials Type: main |
| ResultId | 1 |
