Error Reduction in Infrared Thermography by Multiframe Super-Resolution.
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| Title: | Error Reduction in Infrared Thermography by Multiframe Super-Resolution. |
|---|---|
| Authors: | Chandramohan, Aditya1 chandr22@purdue.edu, Lyons, Sara K.1 lyons20@purdue.edu, Weibel, Justin A.1 jaweibel@purdue.edu, Garimella, Suresh V.1 sureshg@purdue.edu |
| Source: | Journal of Electronic Packaging. Dec2018, Vol. 140 Issue 4, p1-8. 8p. |
| Subjects: | Electronics packaging, High resolution imaging, Emissivity |
| Abstract: | Accurate temperature measurement techniques are critical for monitoring hotspots that induce thermal stresses in electronics packages. Infrared thermography is a popular nonintrusive method for emissivity mapping and measuring surface temperature distribution, but is often impeded by the low native resolution of the camera. A promising technique to mitigate these resolution limits is multiframe super-resolution, which uses multiple subpixel shifted images to generate a single high-resolution image. This study quantifies the error reduction offered by multiframe super-resolution to demonstrate the potential improvement for infrared imaging applications. The multiframe super-resolution reconstruction is implemented using an algorithm developed to interpolate the sub-pixel-shifted low-resolution images to a higher resolution grid. Experimental multiframe super-resolution temperature maps of an electronic component are measured to demonstrate the improvement in feature capture and reduction in aliasing effects. Furthermore, emissivity mapping of the component surface is conducted and demonstrates a dramatic improvement in the temperature correction by multiframe super-resolution. A sensitivity analysis is conducted to assess the effect of registration uncertainty on the multiframe super-resolution algorithm; simulated images are used to demonstrate the smoothing effect at sharp emissivity boundaries as well as improvement in the feature size capture based on the native camera resolution. These results show that, within the limitations of the technique, multiframe super-resolution can be an effective approach for improving the accuracy of emissivity-mapped temperature measurements. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 132518723 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Error Reduction in Infrared Thermography by Multiframe Super-Resolution. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Chandramohan%2C+Aditya%22">Chandramohan, Aditya</searchLink><relatesTo>1</relatesTo><i> chandr22@purdue.edu</i><br /><searchLink fieldCode="AR" term="%22Lyons%2C+Sara+K%2E%22">Lyons, Sara K.</searchLink><relatesTo>1</relatesTo><i> lyons20@purdue.edu</i><br /><searchLink fieldCode="AR" term="%22Weibel%2C+Justin+A%2E%22">Weibel, Justin A.</searchLink><relatesTo>1</relatesTo><i> jaweibel@purdue.edu</i><br /><searchLink fieldCode="AR" term="%22Garimella%2C+Suresh+V%2E%22">Garimella, Suresh V.</searchLink><relatesTo>1</relatesTo><i> sureshg@purdue.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Packaging%22">Journal of Electronic Packaging</searchLink>. Dec2018, Vol. 140 Issue 4, p1-8. 8p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Electronics+packaging%22">Electronics packaging</searchLink><br /><searchLink fieldCode="DE" term="%22High+resolution+imaging%22">High resolution imaging</searchLink><br /><searchLink fieldCode="DE" term="%22Emissivity%22">Emissivity</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Accurate temperature measurement techniques are critical for monitoring hotspots that induce thermal stresses in electronics packages. Infrared thermography is a popular nonintrusive method for emissivity mapping and measuring surface temperature distribution, but is often impeded by the low native resolution of the camera. A promising technique to mitigate these resolution limits is multiframe super-resolution, which uses multiple subpixel shifted images to generate a single high-resolution image. This study quantifies the error reduction offered by multiframe super-resolution to demonstrate the potential improvement for infrared imaging applications. The multiframe super-resolution reconstruction is implemented using an algorithm developed to interpolate the sub-pixel-shifted low-resolution images to a higher resolution grid. Experimental multiframe super-resolution temperature maps of an electronic component are measured to demonstrate the improvement in feature capture and reduction in aliasing effects. Furthermore, emissivity mapping of the component surface is conducted and demonstrates a dramatic improvement in the temperature correction by multiframe super-resolution. A sensitivity analysis is conducted to assess the effect of registration uncertainty on the multiframe super-resolution algorithm; simulated images are used to demonstrate the smoothing effect at sharp emissivity boundaries as well as improvement in the feature size capture based on the native camera resolution. These results show that, within the limitations of the technique, multiframe super-resolution can be an effective approach for improving the accuracy of emissivity-mapped temperature measurements. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Packaging is the property of American Society of Mechanical Engineers and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1115/1.4041360 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 8 StartPage: 1 Subjects: – SubjectFull: Electronics packaging Type: general – SubjectFull: High resolution imaging Type: general – SubjectFull: Emissivity Type: general Titles: – TitleFull: Error Reduction in Infrared Thermography by Multiframe Super-Resolution. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chandramohan, Aditya – PersonEntity: Name: NameFull: Lyons, Sara K. – PersonEntity: Name: NameFull: Weibel, Justin A. – PersonEntity: Name: NameFull: Garimella, Suresh V. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2018 Type: published Y: 2018 Identifiers: – Type: issn-print Value: 10437398 Numbering: – Type: volume Value: 140 – Type: issue Value: 4 Titles: – TitleFull: Journal of Electronic Packaging Type: main |
| ResultId | 1 |
