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Effect of titanium grain orientation on the growth of compounds at diffusion bonded titanium/steel interfaces.

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Title: Effect of titanium grain orientation on the growth of compounds at diffusion bonded titanium/steel interfaces.
Authors: Li, Boxin1 boxin-li@cqu.edu.cn, Chen, Zejun1 zjchen@cqu.edu.cn, He, Weijun1 weijun.he@cqu.edu.cn, Zhou, Ting1, Wang, Ying1, Peng, Lin1, Li, Jun1, Liu, Qing1 qingliu@cqu.edu.cn
Source: Materials Characterization. Feb2019, Vol. 148, p243-251. 9p.
Subjects: Metal-metal bonds, Metal-to-metal contacts, Titanium carbide, Carbon steel, Diffusion bonding (Metals), Grain orientation (Materials), Crystalline interfaces, Grain growth
Abstract: Abstract Commercial pure titanium plates with different grain orientations were successfully bonded to carbon steel plates by diffusion bonding. The Ti/steel interfaces were carefully characterized by scanning electron microscopy, energy-dispersive spectroscopy, electron backscattered diffraction, and X-ray diffraction. The results revealed that TiC was generated at the Ti/steel interface during the diffusion bonding process. The thickness of the TiC layer increased with increasing diffusion temperature and holding time. Furthermore, the orientation of the Ti grains influenced the activation energy for the growth of TiC and affected the thickness of the TiC layer at the Ti/steel interface. The anisotropic growth of the TiC layer was explained by the interstitial diffusion mechanism of C atom in α-Ti. Moreover, the TiC layer acted as a barrier layer at Ti/steel interface, inhibiting the diffusion of Fe atoms into α-Ti. An increased diffusion temperature reduced this barrier effect, leading to the formation of FeTi and Fe 2 Ti at TiC/Ti interface. Highlights • Thickness of TiC at Ti/steel diffusion bonded interface is influence by grain orientation of Ti. • The formation of FeTi and Fe 2 Ti can be suppressed because of formation of TiC. • Elevated diffusion temperature impairs the barrier effect of TiC. [ABSTRACT FROM AUTHOR]
Copyright of Materials Characterization is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 134253763
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
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  Label: Title
  Group: Ti
  Data: Effect of titanium grain orientation on the growth of compounds at diffusion bonded titanium/steel interfaces.
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  Label: Authors
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  Data: <searchLink fieldCode="AR" term="%22Li%2C+Boxin%22">Li, Boxin</searchLink><relatesTo>1</relatesTo><i> boxin-li@cqu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Zejun%22">Chen, Zejun</searchLink><relatesTo>1</relatesTo><i> zjchen@cqu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22He%2C+Weijun%22">He, Weijun</searchLink><relatesTo>1</relatesTo><i> weijun.he@cqu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Zhou%2C+Ting%22">Zhou, Ting</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Wang%2C+Ying%22">Wang, Ying</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Peng%2C+Lin%22">Peng, Lin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Li%2C+Jun%22">Li, Jun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Liu%2C+Qing%22">Liu, Qing</searchLink><relatesTo>1</relatesTo><i> qingliu@cqu.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+Characterization%22">Materials Characterization</searchLink>. Feb2019, Vol. 148, p243-251. 9p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Metal-metal+bonds%22">Metal-metal bonds</searchLink><br /><searchLink fieldCode="DE" term="%22Metal-to-metal+contacts%22">Metal-to-metal contacts</searchLink><br /><searchLink fieldCode="DE" term="%22Titanium+carbide%22">Titanium carbide</searchLink><br /><searchLink fieldCode="DE" term="%22Carbon+steel%22">Carbon steel</searchLink><br /><searchLink fieldCode="DE" term="%22Diffusion+bonding+%28Metals%29%22">Diffusion bonding (Metals)</searchLink><br /><searchLink fieldCode="DE" term="%22Grain+orientation+%28Materials%29%22">Grain orientation (Materials)</searchLink><br /><searchLink fieldCode="DE" term="%22Crystalline+interfaces%22">Crystalline interfaces</searchLink><br /><searchLink fieldCode="DE" term="%22Grain+growth%22">Grain growth</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Abstract Commercial pure titanium plates with different grain orientations were successfully bonded to carbon steel plates by diffusion bonding. The Ti/steel interfaces were carefully characterized by scanning electron microscopy, energy-dispersive spectroscopy, electron backscattered diffraction, and X-ray diffraction. The results revealed that TiC was generated at the Ti/steel interface during the diffusion bonding process. The thickness of the TiC layer increased with increasing diffusion temperature and holding time. Furthermore, the orientation of the Ti grains influenced the activation energy for the growth of TiC and affected the thickness of the TiC layer at the Ti/steel interface. The anisotropic growth of the TiC layer was explained by the interstitial diffusion mechanism of C atom in α-Ti. Moreover, the TiC layer acted as a barrier layer at Ti/steel interface, inhibiting the diffusion of Fe atoms into α-Ti. An increased diffusion temperature reduced this barrier effect, leading to the formation of FeTi and Fe 2 Ti at TiC/Ti interface. Highlights • Thickness of TiC at Ti/steel diffusion bonded interface is influence by grain orientation of Ti. • The formation of FeTi and Fe 2 Ti can be suppressed because of formation of TiC. • Elevated diffusion temperature impairs the barrier effect of TiC. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials Characterization is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.matchar.2018.12.029
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 243
    Subjects:
      – SubjectFull: Metal-metal bonds
        Type: general
      – SubjectFull: Metal-to-metal contacts
        Type: general
      – SubjectFull: Titanium carbide
        Type: general
      – SubjectFull: Carbon steel
        Type: general
      – SubjectFull: Diffusion bonding (Metals)
        Type: general
      – SubjectFull: Grain orientation (Materials)
        Type: general
      – SubjectFull: Crystalline interfaces
        Type: general
      – SubjectFull: Grain growth
        Type: general
    Titles:
      – TitleFull: Effect of titanium grain orientation on the growth of compounds at diffusion bonded titanium/steel interfaces.
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            NameFull: Li, Boxin
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            NameFull: Chen, Zejun
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            NameFull: He, Weijun
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            – D: 01
              M: 02
              Text: Feb2019
              Type: published
              Y: 2019
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              Value: 10445803
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              Value: 148
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