The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing.
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| Title: | The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing. |
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| Authors: | Tian, Yu1, Wang, Yishu1 yishu.wang@bjut.edu.cn, Guo, Fu1, Ma, Limin1, Han, Jing1 |
| Source: | Journal of Electronic Materials. May2019, Vol. 48 Issue 5, p2770-2779. 10p. 4 Color Photographs, 3 Diagrams, 1 Chart, 4 Graphs. |
| Subjects: | Intermetallic compounds, Ball grid array technology, Solder joints, Electron backscattering, Tin |
| Abstract: | The growth behavior of intermetallic compound (IMC) in single crystal Sn3.0Ag0.5Cu (SAC305) and Sn3.0Ag3.0Bi3.0In (SABI333) ball grid array solder joints with Au/Ni/Cu pads under 104 A/cm2 current stressing was investigated. Characterization by scanning electron microscopy and electron backscattered diffraction mapping were utilized to identify the microstructure and crystal orientation of solder joints. The AuSn4 IMC particles in the SAC305 solder matrix were formed along the electron flow direction and c-axis direction of Sn. On the other hand, it was observed that the Au(Sn0.83, In0.17)4 IMC particles generated in SABI333 solder matrix decomposed from needle-like morphology into small pieces of Au(Sn0.23, In0.77)2 during current stressing. This phenomenon depends on the different diffusion rate and opposite migration direction of Sn and In atoms, which have different driving forces. Moreover, the results showed that the growth behavior of IMC particles in SAC305 solder joints was significantly dependent on the c-axis direction of Sn, while that of IMCs in SABI333 was almost maintained without polarization effect. This study indicated that SABI333 solder joints under EM service could exhibit a better performance than that of SAC305 solder joints. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Items | – Name: Title Label: Title Group: Ti Data: The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Tian%2C+Yu%22">Tian, Yu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Wang%2C+Yishu%22">Wang, Yishu</searchLink><relatesTo>1</relatesTo><i> yishu.wang@bjut.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Guo%2C+Fu%22">Guo, Fu</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Ma%2C+Limin%22">Ma, Limin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Han%2C+Jing%22">Han, Jing</searchLink><relatesTo>1</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. May2019, Vol. 48 Issue 5, p2770-2779. 10p. 4 Color Photographs, 3 Diagrams, 1 Chart, 4 Graphs. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Electron+backscattering%22">Electron backscattering</searchLink><br /><searchLink fieldCode="DE" term="%22Tin%22">Tin</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The growth behavior of intermetallic compound (IMC) in single crystal Sn3.0Ag0.5Cu (SAC305) and Sn3.0Ag3.0Bi3.0In (SABI333) ball grid array solder joints with Au/Ni/Cu pads under 104 A/cm2 current stressing was investigated. Characterization by scanning electron microscopy and electron backscattered diffraction mapping were utilized to identify the microstructure and crystal orientation of solder joints. The AuSn4 IMC particles in the SAC305 solder matrix were formed along the electron flow direction and c-axis direction of Sn. On the other hand, it was observed that the Au(Sn0.83, In0.17)4 IMC particles generated in SABI333 solder matrix decomposed from needle-like morphology into small pieces of Au(Sn0.23, In0.77)2 during current stressing. This phenomenon depends on the different diffusion rate and opposite migration direction of Sn and In atoms, which have different driving forces. Moreover, the results showed that the growth behavior of IMC particles in SAC305 solder joints was significantly dependent on the c-axis direction of Sn, while that of IMCs in SABI333 was almost maintained without polarization effect. This study indicated that SABI333 solder joints under EM service could exhibit a better performance than that of SAC305 solder joints. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s11664-018-06907-8 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 10 StartPage: 2770 Subjects: – SubjectFull: Intermetallic compounds Type: general – SubjectFull: Ball grid array technology Type: general – SubjectFull: Solder joints Type: general – SubjectFull: Electron backscattering Type: general – SubjectFull: Tin Type: general Titles: – TitleFull: The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Tian, Yu – PersonEntity: Name: NameFull: Wang, Yishu – PersonEntity: Name: NameFull: Guo, Fu – PersonEntity: Name: NameFull: Ma, Limin – PersonEntity: Name: NameFull: Han, Jing IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 05 Text: May2019 Type: published Y: 2019 Identifiers: – Type: issn-print Value: 03615235 Numbering: – Type: volume Value: 48 – Type: issue Value: 5 Titles: – TitleFull: Journal of Electronic Materials Type: main |
| ResultId | 1 |
