Transient liquid phase bonding in the Cu-Sn system.
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| Title: | Transient liquid phase bonding in the Cu-Sn system. |
|---|---|
| Authors: | Hosseinzaei, Behnam1 (AUTHOR) hosseinzaeaeaman@yahoo.com, Kiani Rashid, Ali Reza1 (AUTHOR) kianirashid@um.ac.ir |
| Source: | Soldering & Surface Mount Technology. 2019, Vol. 31 Issue 4, p221-226. 6p. |
| Subjects: | Copper-tin alloys, Shear strength, Intermetallic compounds, Microhardness testing, Brittle fractures, Optical spectroscopy, Electron microscopy |
| Abstract: | Purpose: This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between phases in bonding region identified through metallography pictures and applying hardness and shear strength tests. Design/methodology/approach: The bonding process was carried out at a temperature of 300°C for time durations ranging from 15 to 120 min. The scanning electron microscopy equipped with energy dispersive spectroscopy system and optical microscopy were used to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine. Findings: The intermetallic compounds of the Cu6Sn5 −η and the Cu3Sn-ε were formed simultaneously in the bonding interface. Although the η-phase, which exhibits scallop-shaped morphology, grows very quickly, upon completion of the isothermal solidification stage, it turns into the ε-phase. The hardness of the bonding interface is significantly higher than that of the substrate. The shear results show that once the bonding process is complete, brittle fracture occurs. Moreover, a greater decrease in strength was observed when the ε-phase is the only phase in the bonding region. Originality/value: The hardness number of the η-phase is higher than that of the ε-phase. The hardness numbers of the η-phase and the ε-phase are 894 and 689 HV, respectively. The mean shear strength values of the samples that were bonded at 300 °C for 15, 60 and 120 min were 11.7, 9.5 and 5.4 MPa, respectively. [ABSTRACT FROM AUTHOR] |
| Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 138174001 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Transient liquid phase bonding in the Cu-Sn system. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Hosseinzaei%2C+Behnam%22">Hosseinzaei, Behnam</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> hosseinzaeaeaman@yahoo.com</i><br /><searchLink fieldCode="AR" term="%22Kiani+Rashid%2C+Ali+Reza%22">Kiani Rashid, Ali Reza</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> kianirashid@um.ac.ir</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2019, Vol. 31 Issue 4, p221-226. 6p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Copper-tin+alloys%22">Copper-tin alloys</searchLink><br /><searchLink fieldCode="DE" term="%22Shear+strength%22">Shear strength</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Microhardness+testing%22">Microhardness testing</searchLink><br /><searchLink fieldCode="DE" term="%22Brittle+fractures%22">Brittle fractures</searchLink><br /><searchLink fieldCode="DE" term="%22Optical+spectroscopy%22">Optical spectroscopy</searchLink><br /><searchLink fieldCode="DE" term="%22Electron+microscopy%22">Electron microscopy</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Purpose: This paper aims to study the features of microstructures and mechanical properties of the joints which were produced by transient liquid phase method. The difference between phases in bonding region identified through metallography pictures and applying hardness and shear strength tests. Design/methodology/approach: The bonding process was carried out at a temperature of 300°C for time durations ranging from 15 to 120 min. The scanning electron microscopy equipped with energy dispersive spectroscopy system and optical microscopy were used to examine microstructural characteristics, and mechanical properties of the joints were studied by applying microhardness and shear tests. The shear tests were conducted by a shear fixture which was mounted on the tensile machine. Findings: The intermetallic compounds of the Cu6Sn5 −η and the Cu3Sn-ε were formed simultaneously in the bonding interface. Although the η-phase, which exhibits scallop-shaped morphology, grows very quickly, upon completion of the isothermal solidification stage, it turns into the ε-phase. The hardness of the bonding interface is significantly higher than that of the substrate. The shear results show that once the bonding process is complete, brittle fracture occurs. Moreover, a greater decrease in strength was observed when the ε-phase is the only phase in the bonding region. Originality/value: The hardness number of the η-phase is higher than that of the ε-phase. The hardness numbers of the η-phase and the ε-phase are 894 and 689 HV, respectively. The mean shear strength values of the samples that were bonded at 300 °C for 15, 60 and 120 min were 11.7, 9.5 and 5.4 MPa, respectively. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1108/SSMT-09-2018-0031 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 221 Subjects: – SubjectFull: Copper-tin alloys Type: general – SubjectFull: Shear strength Type: general – SubjectFull: Intermetallic compounds Type: general – SubjectFull: Microhardness testing Type: general – SubjectFull: Brittle fractures Type: general – SubjectFull: Optical spectroscopy Type: general – SubjectFull: Electron microscopy Type: general Titles: – TitleFull: Transient liquid phase bonding in the Cu-Sn system. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Hosseinzaei, Behnam – PersonEntity: Name: NameFull: Kiani Rashid, Ali Reza IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: 2019 Type: published Y: 2019 Identifiers: – Type: issn-print Value: 09540911 Numbering: – Type: volume Value: 31 – Type: issue Value: 4 Titles: – TitleFull: Soldering & Surface Mount Technology Type: main |
| ResultId | 1 |
