A Novel Automatically Designed EBG Structure by Improved GA for Ultrawideband SSN Mitigation of System in Package.
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| Title: | A Novel Automatically Designed EBG Structure by Improved GA for Ultrawideband SSN Mitigation of System in Package. |
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| Authors: | Zhu, Hao-Ran1 hrzhu86@gmail.com, Wang, Jia-Bao1, Sun, Yu-Fa1, Wu, Xian-Liang1, Mao, Jun-Fa2 |
| Source: | IEEE Transactions on Components, Packaging & Manufacturing Technology. Jan2020, Vol. 10 Issue 1, p123-133. 11p. |
| Subjects: | Power distribution networks, Genetic algorithms, Surface impedance, Impedance spectroscopy |
| Abstract: | In this article, a novel automatically designed electromagnetic bandgap (EBG) structure is presented to prohibit the simultaneous switching noise (SSN) propagation of a system in package. The tool employed for the automatic EBG design is the improved genetic algorithm (GA), which has the advantages of rapid convergence and high precision by combining several improvements reasonably. Meanwhile, the equivalent circuit model and the dispersion diagram of the proposed structure are established to interpret the electromagnetic characteristics of the designed power distribution network (PDN). By removing some patches in a specific area determined by the GA, the surface impedance of PDN can be increased to reduce the SSN coupling. The SSN transmission can be suppressed from 0.37 to 20 GHz at a mitigation level of −50 dB. The measured results agree well with the simulated ones. [ABSTRACT FROM AUTHOR] |
| Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 141257022 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: A Novel Automatically Designed EBG Structure by Improved GA for Ultrawideband SSN Mitigation of System in Package. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Zhu%2C+Hao-Ran%22">Zhu, Hao-Ran</searchLink><relatesTo>1</relatesTo><i> hrzhu86@gmail.com</i><br /><searchLink fieldCode="AR" term="%22Wang%2C+Jia-Bao%22">Wang, Jia-Bao</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Sun%2C+Yu-Fa%22">Sun, Yu-Fa</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Wu%2C+Xian-Liang%22">Wu, Xian-Liang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Mao%2C+Jun-Fa%22">Mao, Jun-Fa</searchLink><relatesTo>2</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Components%2C+Packaging+%26+Manufacturing+Technology%22">IEEE Transactions on Components, Packaging & Manufacturing Technology</searchLink>. Jan2020, Vol. 10 Issue 1, p123-133. 11p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Power+distribution+networks%22">Power distribution networks</searchLink><br /><searchLink fieldCode="DE" term="%22Genetic+algorithms%22">Genetic algorithms</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+impedance%22">Surface impedance</searchLink><br /><searchLink fieldCode="DE" term="%22Impedance+spectroscopy%22">Impedance spectroscopy</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: In this article, a novel automatically designed electromagnetic bandgap (EBG) structure is presented to prohibit the simultaneous switching noise (SSN) propagation of a system in package. The tool employed for the automatic EBG design is the improved genetic algorithm (GA), which has the advantages of rapid convergence and high precision by combining several improvements reasonably. Meanwhile, the equivalent circuit model and the dispersion diagram of the proposed structure are established to interpret the electromagnetic characteristics of the designed power distribution network (PDN). By removing some patches in a specific area determined by the GA, the surface impedance of PDN can be increased to reduce the SSN coupling. The SSN transmission can be suppressed from 0.37 to 20 GHz at a mitigation level of −50 dB. The measured results agree well with the simulated ones. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of IEEE Transactions on Components, Packaging & Manufacturing Technology is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1109/TCPMT.2019.2955823 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 11 StartPage: 123 Subjects: – SubjectFull: Power distribution networks Type: general – SubjectFull: Genetic algorithms Type: general – SubjectFull: Surface impedance Type: general – SubjectFull: Impedance spectroscopy Type: general Titles: – TitleFull: A Novel Automatically Designed EBG Structure by Improved GA for Ultrawideband SSN Mitigation of System in Package. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Zhu, Hao-Ran – PersonEntity: Name: NameFull: Wang, Jia-Bao – PersonEntity: Name: NameFull: Sun, Yu-Fa – PersonEntity: Name: NameFull: Wu, Xian-Liang – PersonEntity: Name: NameFull: Mao, Jun-Fa IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: Jan2020 Type: published Y: 2020 Identifiers: – Type: issn-print Value: 21563950 Numbering: – Type: volume Value: 10 – Type: issue Value: 1 Titles: – TitleFull: IEEE Transactions on Components, Packaging & Manufacturing Technology Type: main |
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