APA (7th ed.) Citation

Feng, C., Chen, L., Tian, G., Bai, L., Bao, R., Liu, Z., . . . Yang, W. (2020). Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1. Chemical Engineering Journal, 392, N.PAG. https://doi.org/10.1016/j.cej.2019.123784

Chicago Style (17th ed.) Citation

Feng, Chang-Ping, Li-Bo Chen, Guo-Liang Tian, Lu Bai, Rui-Ying Bao, Zheng-Ying Liu, Kai Ke, Ming-Bo Yang, and Wei Yang. "Robust Polymer-based Paper-like Thermal Interface Materials with a Through-plane Thermal Conductivity over 9 Wm−1K−1." Chemical Engineering Journal 392 (2020): N.PAG. https://doi.org/10.1016/j.cej.2019.123784.

MLA (9th ed.) Citation

Feng, Chang-Ping, et al. "Robust Polymer-based Paper-like Thermal Interface Materials with a Through-plane Thermal Conductivity over 9 Wm−1K−1." Chemical Engineering Journal, vol. 392, 2020, p. N.PAG, https://doi.org/10.1016/j.cej.2019.123784.