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Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1.

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Title: Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1.
Authors: Feng, Chang-Ping1 (AUTHOR), Chen, Li-Bo1 (AUTHOR), Tian, Guo-Liang1 (AUTHOR), Bai, Lu1 (AUTHOR) slulu_1116@163.com, Bao, Rui-Ying1 (AUTHOR), Liu, Zheng-Ying1 (AUTHOR), Ke, Kai1 (AUTHOR), Yang, Ming-Bo1 (AUTHOR), Yang, Wei1 (AUTHOR) weiyang@scu.edu.cn
Source: Chemical Engineering Journal. Jul2020, Vol. 392, pN.PAG-N.PAG. 1p.
Subjects: Thermal interface materials, Bulk solids, Composite structures, Nanoparticles, Electronic packaging
Abstract: Robust Polymer-based paper-like composites with an ideal-thermal-transportation structure, in which only single-layer Al 2 O 3 particles distributed in the through-plane direction of the films and the Al 2 O 3 particles were covered by highly thermally conductive graphene nanoplatelets (GNPs), were fabricated by a facile vacuum-assisted self-assembly method. The films exhibited the highest through-plane k value (9.09 Wm−1K−1) among reported polymer-based paper-like composites, excellent flexibility (in over 20,000 bending cycles) and robust mechanical properties (tensile strength ~10.6 MPa and elongation at break ~7.6%). • Robust bacterial cellulose (BC) based paper-like composites were reported. • The composite films have an ideal-thermal-transportation structure. • The films exhibited extremely high through-plane k value (9.09 Wm−1K−1). • The films exhibited excellent flexibility and robust mechanical properties. • Outstanding heat management capability was demonstrated. Great progresses have been achieved in paper-like highly thermally conductive films with high in-plane thermal conductivity (k), but their applications are still limited by the unsatisfactory through-plane k (0.05–2 Wm−1K−1). In practical applications, paper-like robust composites with high through-plane k , instead of bulk materials, are highly desired for thermal interface materials (TIMs). In this work, flexible bacterial cellulose (BC) based paper-like composites with an ideal-thermal-transportation structure, in which a single-layer Al 2 O 3 particles are confined in the through-plane direction of the films and the Al 2 O 3 particles are covered by highly thermally conductive graphene nanoplatelets (GNPs), are fabricated by a facile vacuum-assisted self-assembly method. The films exhibit the highest through-plane k value (9.09 Wm−1K−1) among reported polymer-based paper-like composites, excellent flexibility (in over 20,000 bending cycles) and robust mechanical properties (tensile strength ~10.6 MPa and elongation at break ~7.6%). The outstanding heat management capability of the fabricated films is demonstrated by demonstrative experiments and finite volume simulation, clearly showing the great potential to be used as super TIMs in advanced electronic packaging technology. [ABSTRACT FROM AUTHOR]
Copyright of Chemical Engineering Journal is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1.
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– Name: Abstract
  Label: Abstract
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  Data: Robust Polymer-based paper-like composites with an ideal-thermal-transportation structure, in which only single-layer Al 2 O 3 particles distributed in the through-plane direction of the films and the Al 2 O 3 particles were covered by highly thermally conductive graphene nanoplatelets (GNPs), were fabricated by a facile vacuum-assisted self-assembly method. The films exhibited the highest through-plane k value (9.09 Wm−1K−1) among reported polymer-based paper-like composites, excellent flexibility (in over 20,000 bending cycles) and robust mechanical properties (tensile strength ~10.6 MPa and elongation at break ~7.6%). • Robust bacterial cellulose (BC) based paper-like composites were reported. • The composite films have an ideal-thermal-transportation structure. • The films exhibited extremely high through-plane k value (9.09 Wm−1K−1). • The films exhibited excellent flexibility and robust mechanical properties. • Outstanding heat management capability was demonstrated. Great progresses have been achieved in paper-like highly thermally conductive films with high in-plane thermal conductivity (k), but their applications are still limited by the unsatisfactory through-plane k (0.05–2 Wm−1K−1). In practical applications, paper-like robust composites with high through-plane k , instead of bulk materials, are highly desired for thermal interface materials (TIMs). In this work, flexible bacterial cellulose (BC) based paper-like composites with an ideal-thermal-transportation structure, in which a single-layer Al 2 O 3 particles are confined in the through-plane direction of the films and the Al 2 O 3 particles are covered by highly thermally conductive graphene nanoplatelets (GNPs), are fabricated by a facile vacuum-assisted self-assembly method. The films exhibit the highest through-plane k value (9.09 Wm−1K−1) among reported polymer-based paper-like composites, excellent flexibility (in over 20,000 bending cycles) and robust mechanical properties (tensile strength ~10.6 MPa and elongation at break ~7.6%). The outstanding heat management capability of the fabricated films is demonstrated by demonstrative experiments and finite volume simulation, clearly showing the great potential to be used as super TIMs in advanced electronic packaging technology. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Chemical Engineering Journal is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.cej.2019.123784
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
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        PageCount: 1
        StartPage: N.PAG
    Subjects:
      – SubjectFull: Thermal interface materials
        Type: general
      – SubjectFull: Bulk solids
        Type: general
      – SubjectFull: Composite structures
        Type: general
      – SubjectFull: Nanoparticles
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      – SubjectFull: Electronic packaging
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      – TitleFull: Robust polymer-based paper-like thermal interface materials with a through-plane thermal conductivity over 9 Wm−1K−1.
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              M: 07
              Text: Jul2020
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              Y: 2020
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