The electronics design challenges of hypersonic flight: Hypersonic munitions present an intimidating set of environmental challenges, raising the bar to an entirely new level of difficulty.

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Title: The electronics design challenges of hypersonic flight: Hypersonic munitions present an intimidating set of environmental challenges, raising the bar to an entirely new level of difficulty.
Authors: Wilson, J. R.
Source: Military & Aerospace Electronics. May2020, Vol. 31 Issue 5, p18-25. 6p.
Subjects: Level of difficulty, Heat pipes, Electronics, Flight, Vibration (Mechanics), Military weapons, Printed circuit design
Abstract: The article discusses the challenges involved in the electronics design of a fully functional hypersonic system which is being used in the deployment of missiles. Topics discussed include the role of embedded electronics in the production of hypersonic systems, the need for technological advances in propulsion systems, airframe, and embedded electronics according to Lorne Graves of Alabama-based Abaco Systems, and the process of ruggedization to protect electronics from heat.
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 143448588
AccessLevel: 6
PubType: Periodical
PubTypeId: serialPeriodical
PreciseRelevancyScore: 0
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  Data: The electronics design challenges of hypersonic flight: Hypersonic munitions present an intimidating set of environmental challenges, raising the bar to an entirely new level of difficulty.
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  Data: <searchLink fieldCode="AR" term="%22Wilson%2C+J%2E+R%2E%22">Wilson, J. R.</searchLink>
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  Data: <searchLink fieldCode="JN" term="%22Military+%26+Aerospace+Electronics%22">Military & Aerospace Electronics</searchLink>. May2020, Vol. 31 Issue 5, p18-25. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Level+of+difficulty%22">Level of difficulty</searchLink><br /><searchLink fieldCode="DE" term="%22Heat+pipes%22">Heat pipes</searchLink><br /><searchLink fieldCode="DE" term="%22Electronics%22">Electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Flight%22">Flight</searchLink><br /><searchLink fieldCode="DE" term="%22Vibration+%28Mechanics%29%22">Vibration (Mechanics)</searchLink><br /><searchLink fieldCode="DE" term="%22Military+weapons%22">Military weapons</searchLink><br /><searchLink fieldCode="DE" term="%22Printed+circuit+design%22">Printed circuit design</searchLink>
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  Data: The article discusses the challenges involved in the electronics design of a fully functional hypersonic system which is being used in the deployment of missiles. Topics discussed include the role of embedded electronics in the production of hypersonic systems, the need for technological advances in propulsion systems, airframe, and embedded electronics according to Lorne Graves of Alabama-based Abaco Systems, and the process of ruggedization to protect electronics from heat.
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=143448588
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 18
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      – SubjectFull: Level of difficulty
        Type: general
      – SubjectFull: Heat pipes
        Type: general
      – SubjectFull: Electronics
        Type: general
      – SubjectFull: Flight
        Type: general
      – SubjectFull: Vibration (Mechanics)
        Type: general
      – SubjectFull: Military weapons
        Type: general
      – SubjectFull: Printed circuit design
        Type: general
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      – TitleFull: The electronics design challenges of hypersonic flight: Hypersonic munitions present an intimidating set of environmental challenges, raising the bar to an entirely new level of difficulty.
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            – D: 01
              M: 05
              Text: May2020
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              Y: 2020
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