APA (7th ed.) Citation

Pai, H. T., & Lin, C. (2020). Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging. IEEE Transactions on Plasma Science, 48(11), 3915. https://doi.org/10.1109/TPS.2020.3029031

Chicago Style (17th ed.) Citation

Pai, Hsiang Ting, and Che-Hsin Lin. "Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging." IEEE Transactions on Plasma Science 48, no. 11 (2020): 3915. https://doi.org/10.1109/TPS.2020.3029031.

MLA (9th ed.) Citation

Pai, Hsiang Ting, and Che-Hsin Lin. "Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging." IEEE Transactions on Plasma Science, vol. 48, no. 11, 2020, p. 3915, https://doi.org/10.1109/TPS.2020.3029031.