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Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging.

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Title: Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging.
Authors: Pai, Hsiang Ting1, Lin, Che-Hsin1 chehsin@mail.nsysu.edu.tw
Source: IEEE Transactions on Plasma Science. Nov2020, Vol. 48 Issue 11, p3915-3920. 6p.
Subjects: Electric insulators & insulation, Flip chip technology, Semiconductors, Vacuum chambers, Packaging, Numerical calculations, Electric fields
Abstract: Delamination between the molding compound and the die surface is a common failure pattern in the semiconductor package industry. Plasma treatment is a standard process to clean and activate the die surface to enhance the bonding force between the molding compound and the die surface in the packing procedure. However, the unexpected delamination still happens and results in a huge commercial loss for the packaged products. This study adopts experimental and numerical approaches to systematically investigate the delamination risk for plasma treatment before compound molding. A vacuum chamber is established to visualize the plasma distribution and the oxidation condition of the lead frames placed on the metal and the insulator rails. Moreover, a numerical calculation is used to systematically predict the plasma distribution over the lead frame and die surface. Results show that the lead frame placed on the metal rail exhibited a higher electric field gradient than that placed on the insulation rail. Moreover, the copper lead frame placed on the insulation rail exhibits a lower electric field gradient and less metal oxidation on the die surface. The delamination risk for semiconductor packaging can be systematically predicted and efficiently reduced before the packing process with the results obtained in the present study. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Transactions on Plasma Science is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging.
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  Data: <searchLink fieldCode="AR" term="%22Pai%2C+Hsiang+Ting%22">Pai, Hsiang Ting</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Lin%2C+Che-Hsin%22">Lin, Che-Hsin</searchLink><relatesTo>1</relatesTo><i> chehsin@mail.nsysu.edu.tw</i>
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  Data: <searchLink fieldCode="JN" term="%22IEEE+Transactions+on+Plasma+Science%22">IEEE Transactions on Plasma Science</searchLink>. Nov2020, Vol. 48 Issue 11, p3915-3920. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Electric+insulators+%26+insulation%22">Electric insulators & insulation</searchLink><br /><searchLink fieldCode="DE" term="%22Flip+chip+technology%22">Flip chip technology</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductors%22">Semiconductors</searchLink><br /><searchLink fieldCode="DE" term="%22Vacuum+chambers%22">Vacuum chambers</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging%22">Packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Numerical+calculations%22">Numerical calculations</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+fields%22">Electric fields</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: Delamination between the molding compound and the die surface is a common failure pattern in the semiconductor package industry. Plasma treatment is a standard process to clean and activate the die surface to enhance the bonding force between the molding compound and the die surface in the packing procedure. However, the unexpected delamination still happens and results in a huge commercial loss for the packaged products. This study adopts experimental and numerical approaches to systematically investigate the delamination risk for plasma treatment before compound molding. A vacuum chamber is established to visualize the plasma distribution and the oxidation condition of the lead frames placed on the metal and the insulator rails. Moreover, a numerical calculation is used to systematically predict the plasma distribution over the lead frame and die surface. Results show that the lead frame placed on the metal rail exhibited a higher electric field gradient than that placed on the insulation rail. Moreover, the copper lead frame placed on the insulation rail exhibits a lower electric field gradient and less metal oxidation on the die surface. The delamination risk for semiconductor packaging can be systematically predicted and efficiently reduced before the packing process with the results obtained in the present study. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of IEEE Transactions on Plasma Science is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1109/TPS.2020.3029031
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 3915
    Subjects:
      – SubjectFull: Electric insulators & insulation
        Type: general
      – SubjectFull: Flip chip technology
        Type: general
      – SubjectFull: Semiconductors
        Type: general
      – SubjectFull: Vacuum chambers
        Type: general
      – SubjectFull: Packaging
        Type: general
      – SubjectFull: Numerical calculations
        Type: general
      – SubjectFull: Electric fields
        Type: general
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      – TitleFull: Experimental and Numerical Investigation Into the Plasma Treatment and Chip Delamination in Semiconductor Packaging.
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            NameFull: Lin, Che-Hsin
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            – D: 01
              M: 11
              Text: Nov2020
              Type: published
              Y: 2020
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