Bibliographic Details
| Title: |
Rome to Milan, AMD Continues Its Tour of Italy. |
| Authors: |
Mattioli, Michael1 (AUTHOR) michael.mattioli@gs.com |
| Source: |
IEEE Micro. Jul-Aug2021, Vol. 41 Issue 4, p78-83. 6p. |
| Subjects: |
Vertical integration, Tours |
| Geographic Terms: |
Milan (Italy), Rome |
| Abstract: |
AMD's recently released EPYC 7003 series CPUs (codename Milan) deliver performance and power efficiency improvements over its previous generation of data center CPUs (codename Rome). Various architectural improvements were made such as an uplift from the Zen 2 core to the Zen 3 core, unifying the L3 cache, and adding security features. Relative to the competition, AMD's latest data center CPUs are very competitive. However, the looming threat of vertical integration plagues the entire market. [ABSTRACT FROM AUTHOR] |
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| Database: |
Engineering Source |
