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Rome to Milan, AMD Continues Its Tour of Italy.

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Title: Rome to Milan, AMD Continues Its Tour of Italy.
Authors: Mattioli, Michael1 (AUTHOR) michael.mattioli@gs.com
Source: IEEE Micro. Jul-Aug2021, Vol. 41 Issue 4, p78-83. 6p.
Subjects: Vertical integration, Tours
Geographic Terms: Milan (Italy), Rome
Abstract: AMD's recently released EPYC 7003 series CPUs (codename Milan) deliver performance and power efficiency improvements over its previous generation of data center CPUs (codename Rome). Various architectural improvements were made such as an uplift from the Zen 2 core to the Zen 3 core, unifying the L3 cache, and adding security features. Relative to the competition, AMD's latest data center CPUs are very competitive. However, the looming threat of vertical integration plagues the entire market. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Micro is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
FullText Text:
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DbLabel: Engineering Source
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PubType: Academic Journal
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  Data: Rome to Milan, AMD Continues Its Tour of Italy.
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  Data: AMD's recently released EPYC 7003 series CPUs (codename Milan) deliver performance and power efficiency improvements over its previous generation of data center CPUs (codename Rome). Various architectural improvements were made such as an uplift from the Zen 2 core to the Zen 3 core, unifying the L3 cache, and adding security features. Relative to the competition, AMD's latest data center CPUs are very competitive. However, the looming threat of vertical integration plagues the entire market. [ABSTRACT FROM AUTHOR]
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  Data: <i>Copyright of IEEE Micro is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1109/MM.2021.3086541
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 78
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      – SubjectFull: Vertical integration
        Type: general
      – SubjectFull: Tours
        Type: general
      – SubjectFull: Milan (Italy)
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      – TitleFull: Rome to Milan, AMD Continues Its Tour of Italy.
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              Text: Jul-Aug2021
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              Y: 2021
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