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Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil.

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Title: Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil.
Authors: Yu, Linping1 (AUTHOR) linping_yu@csust.edu.cn, Chen, Long1 (AUTHOR), Chen, Qizhi2 (AUTHOR), Feng, Luli3 (AUTHOR), Xu, Ziyi1 (AUTHOR), Nan, Bo4 (AUTHOR), Kang, Xiyue1,3 (AUTHOR) xiyuekang@csu.edu.cn, He, Yuehui3 (AUTHOR)
Source: Journal of Industrial & Engineering Chemistry. Nov2021, Vol. 103, p118-123. 6p.
Subjects: Alloys, Alloy plating, Copper corrosion, Porosity, Corrosion resistance, Electrolytic corrosion, Temperature control, Tensile strength
Abstract: [Display omitted] • An ultrathin Ni-Cu alloy foil was prepared by electrodeposition-vacuum sintering method. • The uniform composition can be achieved through mutual diffusion of atoms. • The Kirkendall pores can be avoided by controlling the sintering temperature. • The Ni-Cu alloy foil shows superior corrosion resistance compared with Cu foil. Cost-effective ultrathin alloy foils (<20 μm) are highly expected with the development of electronic industry and micro-system technology. In this paper, electrodeposition combined with vacuum sintering is used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (±0.2) μm. For the ultrathin Ni-Cu alloy foil, a densified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm−2, 700 s is the optimal electrodeposition time to obtain the highest tensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensile strength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cu alloy foil, which may provide an inspiration for future development of integrated electronic or medical devices. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Industrial & Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 152251387
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  Data: Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil.
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  Data: &lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Yu%2C+Linping%22&quot;&gt;Yu, Linping&lt;/searchLink&gt;&lt;relatesTo&gt;1&lt;/relatesTo&gt; (AUTHOR)&lt;i&gt; linping_yu@csust.edu.cn&lt;/i&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Chen%2C+Long%22&quot;&gt;Chen, Long&lt;/searchLink&gt;&lt;relatesTo&gt;1&lt;/relatesTo&gt; (AUTHOR)&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Chen%2C+Qizhi%22&quot;&gt;Chen, Qizhi&lt;/searchLink&gt;&lt;relatesTo&gt;2&lt;/relatesTo&gt; (AUTHOR)&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Feng%2C+Luli%22&quot;&gt;Feng, Luli&lt;/searchLink&gt;&lt;relatesTo&gt;3&lt;/relatesTo&gt; (AUTHOR)&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Xu%2C+Ziyi%22&quot;&gt;Xu, Ziyi&lt;/searchLink&gt;&lt;relatesTo&gt;1&lt;/relatesTo&gt; (AUTHOR)&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Nan%2C+Bo%22&quot;&gt;Nan, Bo&lt;/searchLink&gt;&lt;relatesTo&gt;4&lt;/relatesTo&gt; (AUTHOR)&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22Kang%2C+Xiyue%22&quot;&gt;Kang, Xiyue&lt;/searchLink&gt;&lt;relatesTo&gt;1,3&lt;/relatesTo&gt; (AUTHOR)&lt;i&gt; xiyuekang@csu.edu.cn&lt;/i&gt;&lt;br /&gt;&lt;searchLink fieldCode=&quot;AR&quot; term=&quot;%22He%2C+Yuehui%22&quot;&gt;He, Yuehui&lt;/searchLink&gt;&lt;relatesTo&gt;3&lt;/relatesTo&gt; (AUTHOR)
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  Data: &lt;searchLink fieldCode=&quot;JN&quot; term=&quot;%22Journal+of+Industrial+%26+Engineering+Chemistry%22&quot;&gt;Journal of Industrial &amp; Engineering Chemistry&lt;/searchLink&gt;. Nov2021, Vol. 103, p118-123. 6p.
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– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: [Display omitted] • An ultrathin Ni-Cu alloy foil was prepared by electrodeposition-vacuum sintering method. • The uniform composition can be achieved through mutual diffusion of atoms. • The Kirkendall pores can be avoided by controlling the sintering temperature. • The Ni-Cu alloy foil shows superior corrosion resistance compared with Cu foil. Cost-effective ultrathin alloy foils (&lt;20 μm) are highly expected with the development of electronic industry and micro-system technology. In this paper, electrodeposition combined with vacuum sintering is used to fabricate a Ni-Cu alloy foil with thickness of 12.0 (&#177;0.2) μm. For the ultrathin Ni-Cu alloy foil, a densified structure without pores can be achieved by prolonging sintering duration at 900 ℃ for 3 h. Under the current density of 10 mA cm−2, 700 s is the optimal electrodeposition time to obtain the highest tensile strength (187 MPa) with the Ni content of 41.5 wt.% in the alloy foil. Compared with Cu foil, Ni-Cu alloy foil shows superior corrosion resistance in 3.5 wt.% NaCl solution and also HCl solutions (0.5 mol/L, 1.0 mol/L, 2.0 mol/L), respectively. The uniform composition and defect-free surface, excellent tensile strength and corrosion resistance together exhibits the great application potential of the obtained Ni-Cu alloy foil, which may provide an inspiration for future development of integrated electronic or medical devices. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: &lt;i&gt;Copyright of Journal of Industrial &amp; Engineering Chemistry is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.jiec.2021.07.025
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 6
        StartPage: 118
    Subjects:
      – SubjectFull: Alloys
        Type: general
      – SubjectFull: Alloy plating
        Type: general
      – SubjectFull: Copper corrosion
        Type: general
      – SubjectFull: Porosity
        Type: general
      – SubjectFull: Corrosion resistance
        Type: general
      – SubjectFull: Electrolytic corrosion
        Type: general
      – SubjectFull: Temperature control
        Type: general
      – SubjectFull: Tensile strength
        Type: general
    Titles:
      – TitleFull: Controlled fabrication and electrochemical corrosion behavior of ultrathin Ni-Cu alloy foil.
        Type: main
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          Name:
            NameFull: Yu, Linping
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            NameFull: Chen, Long
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            NameFull: Chen, Qizhi
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            NameFull: Feng, Luli
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            NameFull: Xu, Ziyi
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            NameFull: Kang, Xiyue
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            NameFull: He, Yuehui
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            – D: 25
              M: 11
              Text: Nov2021
              Type: published
              Y: 2021
          Identifiers:
            – Type: issn-print
              Value: 1226086X
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              Value: 103
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            – TitleFull: Journal of Industrial & Engineering Chemistry
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