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Meet the FaM1ly.

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Title: Meet the FaM1ly.
Authors: Mattioli, Michael1 (AUTHOR) michael.mattioli@gs.com
Source: IEEE Micro. May/Jun2022, Vol. 42 Issue 3, p78-84. 7p.
Subjects: Apple Inc., Vertical integration, Architectural design, Macintosh (Computer), Aversion, Systems on a chip
Abstract: Apple has designed a new family of SoCs for use predominantly within its Mac (desktop and laptop) products: M1, M1 Pro, M1 Max, and M1 Ultra. Its design and architecture are wildly different from its competition, and its overall value and performance have caught the attention of the entire market. They have shown the world that, with full control, they can build secure, efficient, and high-performance systems. While ceding this control to Apple has been met with mild distaste, the benefits are well worth the tradeoffs. Taking a step back, this move is yet another instance of vertical integration which continues to make its rounds throughout the industry. [ABSTRACT FROM AUTHOR]
Copyright of IEEE Micro is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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  Availability: 0
Header DbId: egs
DbLabel: Engineering Source
An: 157007964
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Meet the FaM1ly.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Mattioli%2C+Michael%22">Mattioli, Michael</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> michael.mattioli@gs.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22IEEE+Micro%22">IEEE Micro</searchLink>. May/Jun2022, Vol. 42 Issue 3, p78-84. 7p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Apple+Inc%2E%22">Apple Inc.</searchLink><br /><searchLink fieldCode="DE" term="%22Vertical+integration%22">Vertical integration</searchLink><br /><searchLink fieldCode="DE" term="%22Architectural+design%22">Architectural design</searchLink><br /><searchLink fieldCode="DE" term="%22Macintosh+%28Computer%29%22">Macintosh (Computer)</searchLink><br /><searchLink fieldCode="DE" term="%22Aversion%22">Aversion</searchLink><br /><searchLink fieldCode="DE" term="%22Systems+on+a+chip%22">Systems on a chip</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Apple has designed a new family of SoCs for use predominantly within its Mac (desktop and laptop) products: M1, M1 Pro, M1 Max, and M1 Ultra. Its design and architecture are wildly different from its competition, and its overall value and performance have caught the attention of the entire market. They have shown the world that, with full control, they can build secure, efficient, and high-performance systems. While ceding this control to Apple has been met with mild distaste, the benefits are well worth the tradeoffs. Taking a step back, this move is yet another instance of vertical integration which continues to make its rounds throughout the industry. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of IEEE Micro is the property of IEEE and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/MM.2022.3169245
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 7
        StartPage: 78
    Subjects:
      – SubjectFull: Apple Inc.
        Type: general
      – SubjectFull: Vertical integration
        Type: general
      – SubjectFull: Architectural design
        Type: general
      – SubjectFull: Macintosh (Computer)
        Type: general
      – SubjectFull: Aversion
        Type: general
      – SubjectFull: Systems on a chip
        Type: general
    Titles:
      – TitleFull: Meet the FaM1ly.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Mattioli, Michael
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 05
              Text: May/Jun2022
              Type: published
              Y: 2022
          Identifiers:
            – Type: issn-print
              Value: 02721732
          Numbering:
            – Type: volume
              Value: 42
            – Type: issue
              Value: 3
          Titles:
            – TitleFull: IEEE Micro
              Type: main
ResultId 1