Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.
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| Title: | Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging. |
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| Authors: | Chuang, Wan-Chun1 (AUTHOR) m103020101@student.nsysu.edu.tw, Huang, Yi1 (AUTHOR), Chen, Po-En1 (AUTHOR) |
| Source: | Materials (1996-1944). May2023, Vol. 16 Issue 9, p3482. 15p. |
| Subjects: | Epoxy compounds, Wafer level packaging, Glass transition temperature, Young's modulus, Extreme value theory, Epoxy resins |
| Abstract: | This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young's modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (EL) and 235–260 °C (EH), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between EL and EH. Results show that, within the range of extreme values of material properties, EL and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with EL. EH, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines. [ABSTRACT FROM AUTHOR] |
| Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
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| Items | – Name: Title Label: Title Group: Ti Data: Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Chuang%2C+Wan-Chun%22">Chuang, Wan-Chun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> m103020101@student.nsysu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Huang%2C+Yi%22">Huang, Yi</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Po-En%22">Chen, Po-En</searchLink><relatesTo>1</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. May2023, Vol. 16 Issue 9, p3482. 15p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Epoxy+compounds%22">Epoxy compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Wafer+level+packaging%22">Wafer level packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Glass+transition+temperature%22">Glass transition temperature</searchLink><br /><searchLink fieldCode="DE" term="%22Young's+modulus%22">Young's modulus</searchLink><br /><searchLink fieldCode="DE" term="%22Extreme+value+theory%22">Extreme value theory</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+resins%22">Epoxy resins</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: This study investigated the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. As there is currently a lack of comprehensive discussion on the various material property parameters of EMC materials, it is essential to identify the critical influencing factors and quantify the effects of each parameter on wafer warpage. The material properties include Young's modulus of the epoxy molding compound before and after the glass transition temperature (Tg) range of 25–35 °C (EL) and 235–260 °C (EH), coefficient of thermal expansion (α1, α2), and the temperature change (∆T) between EL and EH. Results show that, within the range of extreme values of material properties, EL and α1 are the critical factors that affect wafer warpage during the decarrier process in fan-out packaging. α1 has a more significant impact on wafer warpage compared with EL. EH, α2, Tg, and ∆T have little influence on wafer warpage. Additionally, the study identified the optimized material property of the epoxy molding compound that can reduce the maximum wafer warpage in the X and Y directions from initial values of 7.34 mm and 7.189 mm to 0.545 mm and 0.45 mm, respectively, resulting in a reduction of wafer warpage of 92.58% (X direction) and 93.74% (Y direction). Thus, this study proposes an approach for evaluating the impact of material properties of epoxy molding compounds on wafer warpage in fan-out wafer-level packaging. The approach aims to address the issue of excessive wafer warpage due to material variation and to provide criteria for selecting appropriate epoxy molding compounds to enhance process yield in packaging production lines. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/ma16093482 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 15 StartPage: 3482 Subjects: – SubjectFull: Epoxy compounds Type: general – SubjectFull: Wafer level packaging Type: general – SubjectFull: Glass transition temperature Type: general – SubjectFull: Young's modulus Type: general – SubjectFull: Extreme value theory Type: general – SubjectFull: Epoxy resins Type: general Titles: – TitleFull: Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chuang, Wan-Chun – PersonEntity: Name: NameFull: Huang, Yi – PersonEntity: Name: NameFull: Chen, Po-En IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 05 Text: May2023 Type: published Y: 2023 Identifiers: – Type: issn-print Value: 19961944 Numbering: – Type: volume Value: 16 – Type: issue Value: 9 Titles: – TitleFull: Materials (1996-1944) Type: main |
| ResultId | 1 |
