Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.
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| Title: | Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls. |
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| Authors: | Reddy, Vishnu V. B.1, Williamson, Jaimal2, Sitaraman, Suresh K.3 suresh.sitaraman@me.gatech.edu |
| Source: | Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 4, p183-189. 7p. |
| Subjects: | Ball grid array technology, Ultrasonic waves, Microelectronic packaging, Nondestructive testing, Data analysis |
| Abstract: | Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 163747438 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Reddy%2C+Vishnu+V%2E+B%2E%22">Reddy, Vishnu V. B.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Williamson%2C+Jaimal%22">Williamson, Jaimal</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Sitaraman%2C+Suresh+K%2E%22">Sitaraman, Suresh K.</searchLink><relatesTo>3</relatesTo><i> suresh.sitaraman@me.gatech.edu</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Microelectronic+%26+Electronic+Packaging%22">Journal of Microelectronic & Electronic Packaging</searchLink>. 2021, Vol. 18 Issue 4, p183-189. 7p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Ball+grid+array+technology%22">Ball grid array technology</searchLink><br /><searchLink fieldCode="DE" term="%22Ultrasonic+waves%22">Ultrasonic waves</searchLink><br /><searchLink fieldCode="DE" term="%22Microelectronic+packaging%22">Microelectronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Nondestructive+testing%22">Nondestructive testing</searchLink><br /><searchLink fieldCode="DE" term="%22Data+analysis%22">Data analysis</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Laser ultrasonic inspection is a novel, noncontact, and nondestructive technique to evaluate the quality of solder interconnections in microelectronic packages. In this technique, identification of defects or failures in solder interconnections is performed by comparing the out-of-plane displacement signals, which are produced from the propagation of ultrasonic waves, from a known good reference sample and sample under test. The laboratory-scale dual-fiber array laser ultrasonic inspection system has successfully demonstrated identifying the defects and failures in the solder interconnections in advanced microelectronic packages such as chip-scale packages, plastic ball grid array packages, and flip-chip ball grid array packages. However, the success of any metrology system depends upon precise and accurate data to be useful in the microelectronic industry. This paper has demonstrated the measurement capability of the dual-fiber array laser ultrasonic inspection system using gage repeatability and reproducibility analysis. Industrial flip-chip ball grid array packages have been used for conducting experiments using the laser ultrasonic inspection system and the inspection data are used to perform repeatability and reproducibility analysis. Gage repeatability and reproducibility studies have also been used to choose a known good reference sample for comparing the samples under test. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Microelectronic & Electronic Packaging is the property of International Microelectronics & Packaging Society and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.4071/imaps.1501802 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 7 StartPage: 183 Subjects: – SubjectFull: Ball grid array technology Type: general – SubjectFull: Ultrasonic waves Type: general – SubjectFull: Microelectronic packaging Type: general – SubjectFull: Nondestructive testing Type: general – SubjectFull: Data analysis Type: general Titles: – TitleFull: Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Reddy, Vishnu V. B. – PersonEntity: Name: NameFull: Williamson, Jaimal – PersonEntity: Name: NameFull: Sitaraman, Suresh K. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 10 Text: 2021 Type: published Y: 2021 Identifiers: – Type: issn-print Value: 15514897 Numbering: – Type: volume Value: 18 – Type: issue Value: 4 Titles: – TitleFull: Journal of Microelectronic & Electronic Packaging Type: main |
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