APA (7th ed.) Citation

Han, J., Ye, P., Braye, S., Whitten, K., Wang, C., Shaffer, D., & Letize, A. (2022). Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features. Advancing Microelectronics, 49(5), 12.

Chicago Style (17th ed.) Citation

Han, Jianwen, Pingping Ye, Stephan Braye, Kyle Whitten, Cai Wang, David Shaffer, and Adam Letize. "Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features." Advancing Microelectronics 49, no. 5 (2022): 12.

MLA (9th ed.) Citation

Han, Jianwen, et al. "Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features." Advancing Microelectronics, vol. 49, no. 5, 2022, p. 12.