APA (7th ed.) Citation

Huang, Y., Lin, Y., Hsiung, C., Hung, T., & Chen, K. (2023). Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. Nanomaterials (2079-4991), 13(17), 2490. https://doi.org/10.3390/nano13172490

Chicago Style (17th ed.) Citation

Huang, Yuan-Chiu, Yu-Xian Lin, Chien-Kang Hsiung, Tzu-Heng Hung, and Kuan-Neng Chen. "Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application." Nanomaterials (2079-4991) 13, no. 17 (2023): 2490. https://doi.org/10.3390/nano13172490.

MLA (9th ed.) Citation

Huang, Yuan-Chiu, et al. "Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application." Nanomaterials (2079-4991), vol. 13, no. 17, 2023, p. 2490, https://doi.org/10.3390/nano13172490.