Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application. - Huang, Yuan-Chiu; Lin, Yu-Xian; Hsiung, Chien-Kang; Hung, Tzu-Heng; Chen, Kuan-Neng (Nanomaterials (2079-4991), 2023)