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Investigation of MRR and surface characterization using plasma process.

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Title: Investigation of MRR and surface characterization using plasma process.
Authors: Singh Yadav, Hari Narayan1 (AUTHOR), Krishna, Enni2 (AUTHOR), Kombath, Sreelakshmy2 (AUTHOR), Dev, D Sam Dayala2 (AUTHOR), Das, Manas1 (AUTHOR) manasdas@iitg.ernet.in
Source: Materials & Manufacturing Processes. 2023, Vol. 38 Issue 13, p1716-1728. 13p.
Subjects: Surface analysis, Plasma materials processing, Plasma pressure, Surface contamination, Surface finishing, Electrochemical cutting, Fused silica
Abstract: Fused silica glass, in particular, offers a broad range of applications in optics. The present study investigates fused silica samples using non-conventional medium-pressure plasma polishing at optimum machining parameters. The polishing parameters, i.e. gas composition (He: (SF6+O2)) of 90:10, pressure ratio (SF6:O2) of 1:1, total pressure of plasma chamber of 5 mbar, and radio-frequency (RF) power of 80 W have been obtained at optimum parametric conditions. The highest material removal rate of 100.36 × 10−3 mm3/min is achieved at optimized process conditions. Even though the surface finish is slightly degraded from 0.28 µm to 0.30 µm, without any surface contamination as analyzed by the 3D optical profiler and Energy-Dispersive X-ray (EDX). Moreover, EDX analysis reveals the presence of fluorine elements after plasma processing, confirming the plasma's interaction with the substrate. Furthermore, Raman spectroscopy results show a maximum 13% reduction in damaged and strained layers after plasma processing on the machined surface.. [ABSTRACT FROM AUTHOR]
Copyright of Materials & Manufacturing Processes is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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An: 172441156
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  Data: Investigation of MRR and surface characterization using plasma process.
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  Data: <searchLink fieldCode="JN" term="%22Materials+%26+Manufacturing+Processes%22">Materials & Manufacturing Processes</searchLink>. 2023, Vol. 38 Issue 13, p1716-1728. 13p.
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  Data: <searchLink fieldCode="DE" term="%22Surface+analysis%22">Surface analysis</searchLink><br /><searchLink fieldCode="DE" term="%22Plasma+materials+processing%22">Plasma materials processing</searchLink><br /><searchLink fieldCode="DE" term="%22Plasma+pressure%22">Plasma pressure</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+contamination%22">Surface contamination</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+finishing%22">Surface finishing</searchLink><br /><searchLink fieldCode="DE" term="%22Electrochemical+cutting%22">Electrochemical cutting</searchLink><br /><searchLink fieldCode="DE" term="%22Fused+silica%22">Fused silica</searchLink>
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  Label: Abstract
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  Data: Fused silica glass, in particular, offers a broad range of applications in optics. The present study investigates fused silica samples using non-conventional medium-pressure plasma polishing at optimum machining parameters. The polishing parameters, i.e. gas composition (He: (SF6+O2)) of 90:10, pressure ratio (SF6:O2) of 1:1, total pressure of plasma chamber of 5 mbar, and radio-frequency (RF) power of 80 W have been obtained at optimum parametric conditions. The highest material removal rate of 100.36 × 10−3 mm3/min is achieved at optimized process conditions. Even though the surface finish is slightly degraded from 0.28 µm to 0.30 µm, without any surface contamination as analyzed by the 3D optical profiler and Energy-Dispersive X-ray (EDX). Moreover, EDX analysis reveals the presence of fluorine elements after plasma processing, confirming the plasma's interaction with the substrate. Furthermore, Raman spectroscopy results show a maximum 13% reduction in damaged and strained layers after plasma processing on the machined surface.. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: <i>Copyright of Materials & Manufacturing Processes is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1080/10426914.2023.2176873
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      – Code: eng
        Text: English
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        PageCount: 13
        StartPage: 1716
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      – SubjectFull: Surface analysis
        Type: general
      – SubjectFull: Plasma materials processing
        Type: general
      – SubjectFull: Plasma pressure
        Type: general
      – SubjectFull: Surface contamination
        Type: general
      – SubjectFull: Surface finishing
        Type: general
      – SubjectFull: Electrochemical cutting
        Type: general
      – SubjectFull: Fused silica
        Type: general
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      – TitleFull: Investigation of MRR and surface characterization using plasma process.
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          Name:
            NameFull: Singh Yadav, Hari Narayan
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            NameFull: Krishna, Enni
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            NameFull: Kombath, Sreelakshmy
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            NameFull: Dev, D Sam Dayala
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            NameFull: Das, Manas
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            – D: 15
              M: 09
              Text: 2023
              Type: published
              Y: 2023
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