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The material removal mechanism in mechanical lapping of diamond cutting tools

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Title: The material removal mechanism in mechanical lapping of diamond cutting tools
Authors: Zong, W.J.1 zongwenjun@hit.edu.cn, Li, D.1, Cheng, K.1,2, Sun, T.1, Wang, H.X.1, Liang, Y.C.1
Source: International Journal of Machine Tools & Manufacture. Jun2005, Vol. 45 Issue 7/8, p783-788. 6p.
Subjects: Planes (Hand tools), Carpentry tools, Crystallography, Anisotropy
Abstract: Abstract: In order to reveal the surface layer removal nature and explain the anisotropy of material removal rate in mechanical lapping single crystal diamond cutting tools, a brittle-ductile transition lapping mechanism is proposed. And then, the dynamic critical depths of cut for brittle-ductile transition in different directions on different planes can be calculated. The lapped surface layer of diamond cutting tool will be removed in plastic mode as long as the embedding depth of diamond grit into the lapped surface is less than the corresponding critical depth of cut. Lapping experiments on the named (110) plane and (100) plane are carried out and the lapped surfaces are measured with atomic force microscope (AFM). The results show that all the lapped surfaces of diamond cutting tools consist of plastic grooves in nanometric scale and the maximal groove depths have prominent anisotropy in different orientations and on different planes, which are consistent with the critical depths of cut well. Therefore, the material removal rate anisotropy of lapped surface layer can be analyzed by comparing the critical depths of cut on different crystallographic planes and in different orientations of the identical plane quantitatively. [Copyright &y& Elsevier]
Copyright of International Journal of Machine Tools & Manufacture is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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Header DbId: egs
DbLabel: Engineering Source
An: 17433997
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: The material removal mechanism in mechanical lapping of diamond cutting tools
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  Data: <searchLink fieldCode="AR" term="%22Zong%2C+W%2EJ%2E%22">Zong, W.J.</searchLink><relatesTo>1</relatesTo><i> zongwenjun@hit.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Li%2C+D%2E%22">Li, D.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Cheng%2C+K%2E%22">Cheng, K.</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AR" term="%22Sun%2C+T%2E%22">Sun, T.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Wang%2C+H%2EX%2E%22">Wang, H.X.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AR" term="%22Liang%2C+Y%2EC%2E%22">Liang, Y.C.</searchLink><relatesTo>1</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Machine+Tools+%26+Manufacture%22">International Journal of Machine Tools & Manufacture</searchLink>. Jun2005, Vol. 45 Issue 7/8, p783-788. 6p.
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  Data: <searchLink fieldCode="DE" term="%22Planes+%28Hand+tools%29%22">Planes (Hand tools)</searchLink><br /><searchLink fieldCode="DE" term="%22Carpentry+tools%22">Carpentry tools</searchLink><br /><searchLink fieldCode="DE" term="%22Crystallography%22">Crystallography</searchLink><br /><searchLink fieldCode="DE" term="%22Anisotropy%22">Anisotropy</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Abstract: In order to reveal the surface layer removal nature and explain the anisotropy of material removal rate in mechanical lapping single crystal diamond cutting tools, a brittle-ductile transition lapping mechanism is proposed. And then, the dynamic critical depths of cut for brittle-ductile transition in different directions on different planes can be calculated. The lapped surface layer of diamond cutting tool will be removed in plastic mode as long as the embedding depth of diamond grit into the lapped surface is less than the corresponding critical depth of cut. Lapping experiments on the named (110) plane and (100) plane are carried out and the lapped surfaces are measured with atomic force microscope (AFM). The results show that all the lapped surfaces of diamond cutting tools consist of plastic grooves in nanometric scale and the maximal groove depths have prominent anisotropy in different orientations and on different planes, which are consistent with the critical depths of cut well. Therefore, the material removal rate anisotropy of lapped surface layer can be analyzed by comparing the critical depths of cut on different crystallographic planes and in different orientations of the identical plane quantitatively. [Copyright &y& Elsevier]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Journal of Machine Tools & Manufacture is the property of Pergamon Press - An Imprint of Elsevier Science and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=17433997
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      – Type: doi
        Value: 10.1016/j.ijmachtools.2004.11.014
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      – Code: eng
        Text: English
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        PageCount: 6
        StartPage: 783
    Subjects:
      – SubjectFull: Planes (Hand tools)
        Type: general
      – SubjectFull: Carpentry tools
        Type: general
      – SubjectFull: Crystallography
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      – SubjectFull: Anisotropy
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      – TitleFull: The material removal mechanism in mechanical lapping of diamond cutting tools
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              M: 06
              Text: Jun2005
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              Y: 2005
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