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SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness.

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Title: SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness.
Authors: Dong, Zhigang1 (AUTHOR), Liu, Shucheng1 (AUTHOR), Kang, Renke1 (AUTHOR), Bao, Yan1 (AUTHOR) baoy@dlut.edu.cn
Source: Materials & Manufacturing Processes. 2024, Vol. 39 Issue 7, p1009-1018. 10p.
Subjects: Compression fractures, Brittle fractures, Surface roughness, Crack propagation, Grinding & polishing, Debonding
Abstract: The thickness of the maximum undistorted chip (agmax) is a crucial component of the machining arguments and significantly affects the quality of the grind. For the purpose of investigating the impact of the agmax on the grinding removal properties of SiO2f/SiO2 composites, grinding experiments of SiO2f/SiO2 composites were conducted. The findings indicate that crack propagation, fiber cracking, matrix breaking, and interface debonding are the primary removal modes of SiO2f/SiO2 composites. Grinding force, surface roughness, and chip size all have a positive correlation with the maximum undeformed chip thickness. Surface brittle fracture brought on by SiO2 fiber microcrack results in little surface roughness. The surface quality degrades when bending fracture and compression fracture take place. Controlling the agmax can enhance the grinding surface quality of SiO2f/SiO2 composites. [ABSTRACT FROM AUTHOR]
Copyright of Materials & Manufacturing Processes is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 176395598
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PubTypeId: academicJournal
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  Label: Title
  Group: Ti
  Data: SiO<subscript>2f</subscript>/SiO<subscript>2</subscript> composite grinding characteristics based on maximum undistorted chip thickness.
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  Data: <searchLink fieldCode="AR" term="%22Dong%2C+Zhigang%22">Dong, Zhigang</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Liu%2C+Shucheng%22">Liu, Shucheng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kang%2C+Renke%22">Kang, Renke</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Bao%2C+Yan%22">Bao, Yan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> baoy@dlut.edu.cn</i>
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  Data: <searchLink fieldCode="JN" term="%22Materials+%26+Manufacturing+Processes%22">Materials & Manufacturing Processes</searchLink>. 2024, Vol. 39 Issue 7, p1009-1018. 10p.
– Name: Subject
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  Data: <searchLink fieldCode="DE" term="%22Compression+fractures%22">Compression fractures</searchLink><br /><searchLink fieldCode="DE" term="%22Brittle+fractures%22">Brittle fractures</searchLink><br /><searchLink fieldCode="DE" term="%22Surface+roughness%22">Surface roughness</searchLink><br /><searchLink fieldCode="DE" term="%22Crack+propagation%22">Crack propagation</searchLink><br /><searchLink fieldCode="DE" term="%22Grinding+%26+polishing%22">Grinding & polishing</searchLink><br /><searchLink fieldCode="DE" term="%22Debonding%22">Debonding</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The thickness of the maximum undistorted chip (agmax) is a crucial component of the machining arguments and significantly affects the quality of the grind. For the purpose of investigating the impact of the agmax on the grinding removal properties of SiO2f/SiO2 composites, grinding experiments of SiO2f/SiO2 composites were conducted. The findings indicate that crack propagation, fiber cracking, matrix breaking, and interface debonding are the primary removal modes of SiO2f/SiO2 composites. Grinding force, surface roughness, and chip size all have a positive correlation with the maximum undeformed chip thickness. Surface brittle fracture brought on by SiO2 fiber microcrack results in little surface roughness. The surface quality degrades when bending fracture and compression fracture take place. Controlling the agmax can enhance the grinding surface quality of SiO2f/SiO2 composites. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Materials & Manufacturing Processes is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1080/10426914.2023.2254366
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 10
        StartPage: 1009
    Subjects:
      – SubjectFull: Compression fractures
        Type: general
      – SubjectFull: Brittle fractures
        Type: general
      – SubjectFull: Surface roughness
        Type: general
      – SubjectFull: Crack propagation
        Type: general
      – SubjectFull: Grinding & polishing
        Type: general
      – SubjectFull: Debonding
        Type: general
    Titles:
      – TitleFull: SiO2f/SiO2 composite grinding characteristics based on maximum undistorted chip thickness.
        Type: main
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            NameFull: Dong, Zhigang
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            NameFull: Liu, Shucheng
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            NameFull: Kang, Renke
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            NameFull: Bao, Yan
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          Dates:
            – D: 15
              M: 05
              Text: 2024
              Type: published
              Y: 2024
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              Value: 39
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              Value: 7
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            – TitleFull: Materials & Manufacturing Processes
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