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Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.

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Title: Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.
Authors: Fang, Yexing1 (AUTHOR), Wang, Taiyu1 (AUTHOR), Gu, Yue2 (AUTHOR) y.gu@yale.edu, Yang, Mingkun1 (AUTHOR), Li, Hong1 (AUTHOR), Shi, Sujun1 (AUTHOR), Zhao, Xiuchen1 (AUTHOR), Huo, Yongjun1 (AUTHOR) y.gu@yale.edu
Source: Materials (1996-1944). Apr2024, Vol. 17 Issue 7, p1658. 17p.
Subjects: Anisotropic conductive films, Wafer level packaging, Three-dimensional integrated circuits, Adhesives, Strains & stresses (Mechanics), Flexible printed circuits, Finite element method
Abstract: In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device developments such as wafer-level packaging and three-dimensional multi-layer integrated circuit board assembly. To overcome these difficulties, we studied two types of ACFs with distinct conductive filler sizes (ACF-1: ~20 μm and ACF-2: ~5 μm). We demonstrated a low-pressure thermo-compression bonding technique and investigated the size effect of conductive particles on ACF's mechanical properties in a customized testing device, which consists of flexible printing circuits and Flex on Flex assemblies. A consistency of low interconnection resistance (<1 Ω) after mechanical stress (cycling bending test up to 600 cycles) verifies the assembly's outstanding electrical reliability and mechanical stability and thus validates the great effectiveness of the ACF bonding technique. Additionally, in numerical studies using the finite element method, we developed a generic model to disclose the size effect of Au/Ni-coated polymer fillers in ACF on device reliability under mechanical stress. For the first time, we confirmed that ACFs with smaller filler particles are more prone to coating fracture, leading to deteriorated electrical interconnections, and are more likely to peel off from substrate electrode pads resulting in electrical faults. This study provides guides for ACF design and manufacturing and would facilitate the advancement of soft wearable electronic devices. [ABSTRACT FROM AUTHOR]
Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.
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  Data: &lt;searchLink fieldCode=&quot;JN&quot; term=&quot;%22Materials+%281996-1944%29%22&quot;&gt;Materials (1996-1944)&lt;/searchLink&gt;. Apr2024, Vol. 17 Issue 7, p1658. 17p.
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– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: In soft electronics, anisotropic conductive adhesive films (ACFs) are the trending interconnecting approach due to their substantial softness and superior bondability to flexible substrates. However, low bonding pressure (≤1 MPa) and fine-pitch interconnections of ACFs become challenging while being extended in advanced device developments such as wafer-level packaging and three-dimensional multi-layer integrated circuit board assembly. To overcome these difficulties, we studied two types of ACFs with distinct conductive filler sizes (ACF-1: ~20 μm and ACF-2: ~5 μm). We demonstrated a low-pressure thermo-compression bonding technique and investigated the size effect of conductive particles on ACF&#39;s mechanical properties in a customized testing device, which consists of flexible printing circuits and Flex on Flex assemblies. A consistency of low interconnection resistance (&lt;1 Ω) after mechanical stress (cycling bending test up to 600 cycles) verifies the assembly&#39;s outstanding electrical reliability and mechanical stability and thus validates the great effectiveness of the ACF bonding technique. Additionally, in numerical studies using the finite element method, we developed a generic model to disclose the size effect of Au/Ni-coated polymer fillers in ACF on device reliability under mechanical stress. For the first time, we confirmed that ACFs with smaller filler particles are more prone to coating fracture, leading to deteriorated electrical interconnections, and are more likely to peel off from substrate electrode pads resulting in electrical faults. This study provides guides for ACF design and manufacturing and would facilitate the advancement of soft wearable electronic devices. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
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  Data: &lt;i&gt;Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder&#39;s express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.&lt;/i&gt; (Copyright applies to all Abstracts.)
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        Value: 10.3390/ma17071658
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      – Code: eng
        Text: English
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        PageCount: 17
        StartPage: 1658
    Subjects:
      – SubjectFull: Anisotropic conductive films
        Type: general
      – SubjectFull: Wafer level packaging
        Type: general
      – SubjectFull: Three-dimensional integrated circuits
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      – SubjectFull: Adhesives
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      – SubjectFull: Strains & stresses (Mechanics)
        Type: general
      – SubjectFull: Flexible printed circuits
        Type: general
      – SubjectFull: Finite element method
        Type: general
    Titles:
      – TitleFull: Size Effects of Au/Ni-Coated Polymer Particles on the Electrical Performance of Anisotropic Conductive Adhesive Films under Flexible Mechanical Conditions.
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            NameFull: Fang, Yexing
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              M: 04
              Text: Apr2024
              Type: published
              Y: 2024
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