APA (7th ed.) Citation

Ueshima, Y., Hasegawa, M., Kubota, N., Matamura, Y., Matsubara, E., Seki, K., & Hirato, T. (2024). Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar–O2 Mixed Gas. Metallurgical & Materials Transactions. Part A, 55(7), 2264. https://doi.org/10.1007/s11661-024-07392-x

Chicago Style (17th ed.) Citation

Ueshima, Yoshiyuki, Masakatsu Hasegawa, Naoyoshi Kubota, Yuya Matamura, Eiichiro Matsubara, Kazuaki Seki, and Tetsuji Hirato. "Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar–O2 Mixed Gas." Metallurgical & Materials Transactions. Part A 55, no. 7 (2024): 2264. https://doi.org/10.1007/s11661-024-07392-x.

MLA (9th ed.) Citation

Ueshima, Yoshiyuki, et al. "Thermal Stability of Nanocrystalline Ag–Cu–Al Alloy Films with Densely Dispersed Alumina Particles Prepared via Reactive Sputtering Using Ar–O2 Mixed Gas." Metallurgical & Materials Transactions. Part A, vol. 55, no. 7, 2024, p. 2264, https://doi.org/10.1007/s11661-024-07392-x.