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Transient liquid phase bonding method of SnIn for high-temperature packaging.

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Title: Transient liquid phase bonding method of SnIn for high-temperature packaging.
Authors: Wang, Jianhao1,2 (AUTHOR) wangjh_gareth@outlook.com, Yao, Yuyuan1 (AUTHOR), Jin, Haibin2 (AUTHOR), Wang, Shuiqing2 (AUTHOR)
Source: Journal of Materials Science: Materials in Electronics. Jul2024, Vol. 35 Issue 19, p1-10. 10p.
Subjects: Copper-tin alloys, High temperature electronics, Solder & soldering, Packaging materials, Semiconductor materials, Semiconductor technology
Abstract: With the increasing development of semiconductors materials and technology, higher demands are emphasized on the packaging methods and materials for the high-temperature electronics. In this investigation, a novel packaging method by eutectic SnIn solder foils using transient liquid phase (TLP) bonding without pressure was introduced, and the microstructures as well as performance evolution of joint bonded at different bonding parameters were analyzed. During the bonding process, the solder alloy as well as weak Cu2In were gradually consumed, and full Cu6(In, Sn)5 bondline could be obtained without any obvious defects at only 200 °C. Higher temperature and longer time could give a further enhancement on the microstructure and the mechanical performance, where dense robust Cu3(In, Sn) bondline formed. Owing to the microstructure optimization, the average shear strength of bonded joint increased by 301.87%. With the great performance and eco-efficiency, this novel TLP-bonding method using SnIn solder foil is capable to meet the increasing requirement of high-temperature packaging. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 178209639
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PubTypeId: academicJournal
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  Data: Transient liquid phase bonding method of SnIn for high-temperature packaging.
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  Data: <searchLink fieldCode="AR" term="%22Wang%2C+Jianhao%22">Wang, Jianhao</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> wangjh_gareth@outlook.com</i><br /><searchLink fieldCode="AR" term="%22Yao%2C+Yuyuan%22">Yao, Yuyuan</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Jin%2C+Haibin%22">Jin, Haibin</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wang%2C+Shuiqing%22">Wang, Shuiqing</searchLink><relatesTo>2</relatesTo> (AUTHOR)
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>. Jul2024, Vol. 35 Issue 19, p1-10. 10p.
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  Data: <searchLink fieldCode="DE" term="%22Copper-tin+alloys%22">Copper-tin alloys</searchLink><br /><searchLink fieldCode="DE" term="%22High+temperature+electronics%22">High temperature electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink><br /><searchLink fieldCode="DE" term="%22Packaging+materials%22">Packaging materials</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+materials%22">Semiconductor materials</searchLink><br /><searchLink fieldCode="DE" term="%22Semiconductor+technology%22">Semiconductor technology</searchLink>
– Name: Abstract
  Label: Abstract
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  Data: With the increasing development of semiconductors materials and technology, higher demands are emphasized on the packaging methods and materials for the high-temperature electronics. In this investigation, a novel packaging method by eutectic SnIn solder foils using transient liquid phase (TLP) bonding without pressure was introduced, and the microstructures as well as performance evolution of joint bonded at different bonding parameters were analyzed. During the bonding process, the solder alloy as well as weak Cu2In were gradually consumed, and full Cu6(In, Sn)5 bondline could be obtained without any obvious defects at only 200 °C. Higher temperature and longer time could give a further enhancement on the microstructure and the mechanical performance, where dense robust Cu3(In, Sn) bondline formed. Owing to the microstructure optimization, the average shear strength of bonded joint increased by 301.87%. With the great performance and eco-efficiency, this novel TLP-bonding method using SnIn solder foil is capable to meet the increasing requirement of high-temperature packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Materials Science: Materials in Electronics is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-024-13079-1
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      – Code: eng
        Text: English
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        PageCount: 10
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    Subjects:
      – SubjectFull: Copper-tin alloys
        Type: general
      – SubjectFull: High temperature electronics
        Type: general
      – SubjectFull: Solder & soldering
        Type: general
      – SubjectFull: Packaging materials
        Type: general
      – SubjectFull: Semiconductor materials
        Type: general
      – SubjectFull: Semiconductor technology
        Type: general
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      – TitleFull: Transient liquid phase bonding method of SnIn for high-temperature packaging.
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            NameFull: Wang, Jianhao
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            NameFull: Yao, Yuyuan
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            NameFull: Jin, Haibin
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            NameFull: Wang, Shuiqing
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          Dates:
            – D: 01
              M: 07
              Text: Jul2024
              Type: published
              Y: 2024
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              Value: 09574522
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              Value: 35
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              Value: 19
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
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