Managing heat for electronics
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| Title: | Managing heat for electronics |
|---|---|
| Authors: | Schelling, Patrick K.1 pschell@mail.ucf.edu, Shi, Li2, Goodson, Kenneth E.3 |
| Source: | Materials Today. Jun2005, Vol. 8 Issue 6, p30-35. 6p. |
| Subjects: | Energy level densities, Electric charge, Transistors, Integrated circuits, Thermal conductivity, Carbon, Nanotubes |
| Abstract: | Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications. [Copyright &y& Elsevier] |
| Copyright of Materials Today is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
| FullText | Text: Availability: 0 |
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| Header | DbId: egs DbLabel: Engineering Source An: 17826853 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Managing heat for electronics – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Schelling%2C+Patrick+K%2E%22">Schelling, Patrick K.</searchLink><relatesTo>1</relatesTo><i> pschell@mail.ucf.edu</i><br /><searchLink fieldCode="AR" term="%22Shi%2C+Li%22">Shi, Li</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AR" term="%22Goodson%2C+Kenneth+E%2E%22">Goodson, Kenneth E.</searchLink><relatesTo>3</relatesTo> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+Today%22">Materials Today</searchLink>. Jun2005, Vol. 8 Issue 6, p30-35. 6p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Energy+level+densities%22">Energy level densities</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+charge%22">Electric charge</searchLink><br /><searchLink fieldCode="DE" term="%22Transistors%22">Transistors</searchLink><br /><searchLink fieldCode="DE" term="%22Integrated+circuits%22">Integrated circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Thermal+conductivity%22">Thermal conductivity</searchLink><br /><searchLink fieldCode="DE" term="%22Carbon%22">Carbon</searchLink><br /><searchLink fieldCode="DE" term="%22Nanotubes%22">Nanotubes</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high-conductivity materials. This article reviews recent materials advances with a focus on novel composite substrates and interface materials, including those composites leveraging the high conductivities of carbon nanotubes. Furthermore, attention is given to the special properties of one-dimensional structures that are likely to be of increasing importance in future applications. [Copyright &y& Elsevier] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Materials Today is the property of Elsevier B.V. and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=17826853 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1016/S1369-7021(05)70935-4 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 30 Subjects: – SubjectFull: Energy level densities Type: general – SubjectFull: Electric charge Type: general – SubjectFull: Transistors Type: general – SubjectFull: Integrated circuits Type: general – SubjectFull: Thermal conductivity Type: general – SubjectFull: Carbon Type: general – SubjectFull: Nanotubes Type: general Titles: – TitleFull: Managing heat for electronics Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Schelling, Patrick K. – PersonEntity: Name: NameFull: Shi, Li – PersonEntity: Name: NameFull: Goodson, Kenneth E. IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 06 Text: Jun2005 Type: published Y: 2005 Identifiers: – Type: issn-print Value: 13697021 Numbering: – Type: volume Value: 8 – Type: issue Value: 6 Titles: – TitleFull: Materials Today Type: main |
| ResultId | 1 |
