APA (7th ed.) Citation

Oh, S., Back, G., Park, S., Lee, H., Seo, H., Kim, Y., & Kim, T. (2024). Optimization of surface filtration to enhance wafer uniformity by removing large particle in ceria slurry. Materials Science in Semiconductor Processing, 183, N.PAG. https://doi.org/10.1016/j.mssp.2024.108740

Chicago Style (17th ed.) Citation

Oh, Seungjun, Geumji Back, Sanghyeon Park, HunWook Lee, Heedo Seo, Yoonsub Kim, and Taesung Kim. "Optimization of Surface Filtration to Enhance Wafer Uniformity by Removing Large Particle in Ceria Slurry." Materials Science in Semiconductor Processing 183 (2024): N.PAG. https://doi.org/10.1016/j.mssp.2024.108740.

MLA (9th ed.) Citation

Oh, Seungjun, et al. "Optimization of Surface Filtration to Enhance Wafer Uniformity by Removing Large Particle in Ceria Slurry." Materials Science in Semiconductor Processing, vol. 183, 2024, p. N.PAG, https://doi.org/10.1016/j.mssp.2024.108740.