APA (7th ed.) Citation

Shih, M., Chen, S., Lin, I. H., Lou, B., & Ni, T. (2024). Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages. Journal of Electronic Materials, 53(12), 8066. https://doi.org/10.1007/s11664-024-11420-2

Chicago Style (17th ed.) Citation

Shih, Meng-Kai, Shi-Jie Chen, I. Hung Lin, Bai-Yao Lou, and Tom Ni. "Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages." Journal of Electronic Materials 53, no. 12 (2024): 8066. https://doi.org/10.1007/s11664-024-11420-2.

MLA (9th ed.) Citation

Shih, Meng-Kai, et al. "Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages." Journal of Electronic Materials, vol. 53, no. 12, 2024, p. 8066, https://doi.org/10.1007/s11664-024-11420-2.