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Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.

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Title: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
Authors: Shih, Meng-Kai1 (AUTHOR) mkshih@mail.nsysu.edu.tw, Chen, Shi-Jie2 (AUTHOR), Lin, I. Hung3 (AUTHOR), Lou, Bai-Yao3 (AUTHOR), Ni, Tom3 (AUTHOR)
Source: Journal of Electronic Materials. Dec2024, Vol. 53 Issue 12, p8066-8077. 12p.
Subjects: Surface mount technology, Response surfaces (Statistics), Epoxy compounds, Copper, Thermomechanical properties of metals, Thermocycling
Abstract: Fan-out (FO) packages are in high demand for smartphones and Internet of Things (IoT) devices because they allow for the integration of multiple components within a single package, leading to enhanced functionality and improved operational performance. In addition, the shift from solder bumps to copper pillar bumps for interconnection is expected to become a prevalent trend in FO package assemblies because of their superior electrical and thermal performance and ability to achieve a finer pitch. However, the increased stiffness of the copper pillars increases the risk of interface fractures between the pillars and solder bumps during the surface mount technology process, which may degrade the thermal cycle test (TCT) reliability. Consequently, the present study develops a three-dimensional (3D) computational model, which approximates the thermomechanical properties of the redistribution layer (RDL) using the rule of mixtures principle, to analyze the reliability of the Cu pillar bumps in FO packages under thermal cycling between −55°C and 125°C. The tensile stress–strain properties of the polyimide (PI) film in the FO package are determined experimentally using an MTS Acumen microforce tester. The experimental data are used to construct an empirical formula for predicting the stress–strain response of the PI film, which is then incorporated into the simulation model. The validity of the simulation model is confirmed by comparing the predicted results for the out-of-plane deformation of the FO package with experimental observations. The reliability of the Cu pillar bumps under TCT processing is investigated numerically using the Anand viscoplastic constitutive model. Finally, a second-order response surface methodology model and Box–Wilson central composite design method are employed to determine the optimal design of the FO package that minimizes the plastic work density of the Cu pillar bumps. The results show that the thermomechanical reliability of the FO package depends mainly on the Cu trace coverage in the RDL and the thickness of the epoxy molding compound layer. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 180990515
AccessLevel: 6
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PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Shih%2C+Meng-Kai%22">Shih, Meng-Kai</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> mkshih@mail.nsysu.edu.tw</i><br /><searchLink fieldCode="AR" term="%22Chen%2C+Shi-Jie%22">Chen, Shi-Jie</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lin%2C+I%2E+Hung%22">Lin, I. Hung</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lou%2C+Bai-Yao%22">Lou, Bai-Yao</searchLink><relatesTo>3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Ni%2C+Tom%22">Ni, Tom</searchLink><relatesTo>3</relatesTo> (AUTHOR)
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>. Dec2024, Vol. 53 Issue 12, p8066-8077. 12p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Surface+mount+technology%22">Surface mount technology</searchLink><br /><searchLink fieldCode="DE" term="%22Response+surfaces+%28Statistics%29%22">Response surfaces (Statistics)</searchLink><br /><searchLink fieldCode="DE" term="%22Epoxy+compounds%22">Epoxy compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Thermomechanical+properties+of+metals%22">Thermomechanical properties of metals</searchLink><br /><searchLink fieldCode="DE" term="%22Thermocycling%22">Thermocycling</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Fan-out (FO) packages are in high demand for smartphones and Internet of Things (IoT) devices because they allow for the integration of multiple components within a single package, leading to enhanced functionality and improved operational performance. In addition, the shift from solder bumps to copper pillar bumps for interconnection is expected to become a prevalent trend in FO package assemblies because of their superior electrical and thermal performance and ability to achieve a finer pitch. However, the increased stiffness of the copper pillars increases the risk of interface fractures between the pillars and solder bumps during the surface mount technology process, which may degrade the thermal cycle test (TCT) reliability. Consequently, the present study develops a three-dimensional (3D) computational model, which approximates the thermomechanical properties of the redistribution layer (RDL) using the rule of mixtures principle, to analyze the reliability of the Cu pillar bumps in FO packages under thermal cycling between −55°C and 125°C. The tensile stress–strain properties of the polyimide (PI) film in the FO package are determined experimentally using an MTS Acumen microforce tester. The experimental data are used to construct an empirical formula for predicting the stress–strain response of the PI film, which is then incorporated into the simulation model. The validity of the simulation model is confirmed by comparing the predicted results for the out-of-plane deformation of the FO package with experimental observations. The reliability of the Cu pillar bumps under TCT processing is investigated numerically using the Anand viscoplastic constitutive model. Finally, a second-order response surface methodology model and Box–Wilson central composite design method are employed to determine the optimal design of the FO package that minimizes the plastic work density of the Cu pillar bumps. The results show that the thermomechanical reliability of the FO package depends mainly on the Cu trace coverage in the RDL and the thickness of the epoxy molding compound layer. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Electronic Materials is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s11664-024-11420-2
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 12
        StartPage: 8066
    Subjects:
      – SubjectFull: Surface mount technology
        Type: general
      – SubjectFull: Response surfaces (Statistics)
        Type: general
      – SubjectFull: Epoxy compounds
        Type: general
      – SubjectFull: Copper
        Type: general
      – SubjectFull: Thermomechanical properties of metals
        Type: general
      – SubjectFull: Thermocycling
        Type: general
    Titles:
      – TitleFull: Thermal Cycle Reliability of Copper Pillar Bumps in Advanced Fan-Out Packages.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Shih, Meng-Kai
      – PersonEntity:
          Name:
            NameFull: Chen, Shi-Jie
      – PersonEntity:
          Name:
            NameFull: Lin, I. Hung
      – PersonEntity:
          Name:
            NameFull: Lou, Bai-Yao
      – PersonEntity:
          Name:
            NameFull: Ni, Tom
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 12
              Text: Dec2024
              Type: published
              Y: 2024
          Identifiers:
            – Type: issn-print
              Value: 03615235
          Numbering:
            – Type: volume
              Value: 53
            – Type: issue
              Value: 12
          Titles:
            – TitleFull: Journal of Electronic Materials
              Type: main
ResultId 1