APA (7th ed.) Citation

Azman, M. A., Abdullah, M., Loh, W. K., & Ooi, C. K. (2025). Advancing packaging technology: Computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages. Soldering & Surface Mount Technology, 37(1), 1. https://doi.org/10.1108/SSMT-05-2024-0022

Chicago Style (17th ed.) Citation

Azman, Muhammad Aqil, Mz Abdullah, Wei Keat Loh, and Chun Keang Ooi. "Advancing Packaging Technology: Computational Fluid Dynamics Modeling for Capillary Underfill Encapsulant in Multi-chip Heterogenous Packages." Soldering & Surface Mount Technology 37, no. 1 (2025): 1. https://doi.org/10.1108/SSMT-05-2024-0022.

MLA (9th ed.) Citation

Azman, Muhammad Aqil, et al. "Advancing Packaging Technology: Computational Fluid Dynamics Modeling for Capillary Underfill Encapsulant in Multi-chip Heterogenous Packages." Soldering & Surface Mount Technology, vol. 37, no. 1, 2025, p. 1, https://doi.org/10.1108/SSMT-05-2024-0022.