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Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages.

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Title: Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages.
Authors: Azman, Muhammad Aqil1 (AUTHOR) m_aqil37@yahoo.com.my, Abdullah, Mz2 (AUTHOR) mezul@usm.my, Loh, Wei Keat3 (AUTHOR) wei.keat.loh@intel.com, Ooi, Chun Keang3 (AUTHOR) chun.keang.ooi@intel.com
Source: Soldering & Surface Mount Technology. 2025, Vol. 37 Issue 1, p1-16. 16p.
Subjects: Computational fluid dynamics, Capillary flow, Properties of fluids, Electronic packaging, Non-Newtonian fluids
Abstract: Purpose: The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to understand how various parameters, such as chip-to-chip spacing (S12), chip thickness (tc) and others, affect the underfill flow process. By using computational fluid dynamics (CFD) simulations and experimental studies, the goal is to provide insights into understanding the dynamics of CUF in heterogeneous electronic packaging. Design/methodology/approach: The paper introduces a CFD analysis and experimental study on CUF in a multi-chip configuration, aiming to understand underfill flow dynamics. A 3D geometry models of multi-chip arrangement are created using computer-aided design (CAD) software. After that, the CAD models are meshed and simulated in Ansys Fluent using incompressible and non-Newtonian fluid properties. The study maintains S12 of 2.86 and tc of 22.29 between experimental and simulation data for results validation. Next, a various of S12 values (1.14, 2.86, 5.71, 8.57, 14.29 and 20) which focus on tc of 22.29 have been investigated. Further studies have been conduct using S12 of 5.71 and tc of 8.00, 14.29 and 22.29. Findings: Results show a strong correlation between simulation and experiment which validate the correctness and robustness of simulation. Further parameter's studies using simulation for various of S12 indicated that higher S12 values lead to faster flow. This effect is due to large underfill weight from reservoir able to flow into S12 region which contributed to higher mass momentum movement. Furthermore, the effect of various of tc shows that the thicker the chip the faster the underfill to flow in S12 region. Research limitations/implications: The intentional exclusion of solder bump pattern arrangements from the experiment and simulation may limit the study's ability to fully understand the impact of solder bump patterns on underfill flow. Therefore, more parameters can be investigated such as solder bump pattern, underfill weight and dispense pattern in the future using CFD. Practical implications: The manuscript provides a comprehensive examination of the contributions of CFD to the advancement of knowledge regarding CUF phenomena in heterogeneous electronic packaging assemblies. Moreover, it delineates the utilization of CFD methodologies to assess the influence of chip-to-chip spacing (S12) and the thickness of the chip (tc) on the underfill flow characteristics. Originality/value: This paper fulfills an identified need of computational fluid dynamics method to study capillary underfill flow dynamics in heterogenous electronic packaging. [ABSTRACT FROM AUTHOR]
Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
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DbLabel: Engineering Source
An: 181983974
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PubType: Academic Journal
PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Azman%2C+Muhammad+Aqil%22">Azman, Muhammad Aqil</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> m_aqil37@yahoo.com.my</i><br /><searchLink fieldCode="AR" term="%22Abdullah%2C+Mz%22">Abdullah, Mz</searchLink><relatesTo>2</relatesTo> (AUTHOR)<i> mezul@usm.my</i><br /><searchLink fieldCode="AR" term="%22Loh%2C+Wei+Keat%22">Loh, Wei Keat</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> wei.keat.loh@intel.com</i><br /><searchLink fieldCode="AR" term="%22Ooi%2C+Chun+Keang%22">Ooi, Chun Keang</searchLink><relatesTo>3</relatesTo> (AUTHOR)<i> chun.keang.ooi@intel.com</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Soldering+%26+Surface+Mount+Technology%22">Soldering & Surface Mount Technology</searchLink>. 2025, Vol. 37 Issue 1, p1-16. 16p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Computational+fluid+dynamics%22">Computational fluid dynamics</searchLink><br /><searchLink fieldCode="DE" term="%22Capillary+flow%22">Capillary flow</searchLink><br /><searchLink fieldCode="DE" term="%22Properties+of+fluids%22">Properties of fluids</searchLink><br /><searchLink fieldCode="DE" term="%22Electronic+packaging%22">Electronic packaging</searchLink><br /><searchLink fieldCode="DE" term="%22Non-Newtonian+fluids%22">Non-Newtonian fluids</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Purpose: The purpose of this study is to investigate the dynamics of capillary underfill flow (CUF) in flip-chip packaging, particularly in a multi-chip configuration. The study aims to understand how various parameters, such as chip-to-chip spacing (S12), chip thickness (tc) and others, affect the underfill flow process. By using computational fluid dynamics (CFD) simulations and experimental studies, the goal is to provide insights into understanding the dynamics of CUF in heterogeneous electronic packaging. Design/methodology/approach: The paper introduces a CFD analysis and experimental study on CUF in a multi-chip configuration, aiming to understand underfill flow dynamics. A 3D geometry models of multi-chip arrangement are created using computer-aided design (CAD) software. After that, the CAD models are meshed and simulated in Ansys Fluent using incompressible and non-Newtonian fluid properties. The study maintains S12 of 2.86 and tc of 22.29 between experimental and simulation data for results validation. Next, a various of S12 values (1.14, 2.86, 5.71, 8.57, 14.29 and 20) which focus on tc of 22.29 have been investigated. Further studies have been conduct using S12 of 5.71 and tc of 8.00, 14.29 and 22.29. Findings: Results show a strong correlation between simulation and experiment which validate the correctness and robustness of simulation. Further parameter's studies using simulation for various of S12 indicated that higher S12 values lead to faster flow. This effect is due to large underfill weight from reservoir able to flow into S12 region which contributed to higher mass momentum movement. Furthermore, the effect of various of tc shows that the thicker the chip the faster the underfill to flow in S12 region. Research limitations/implications: The intentional exclusion of solder bump pattern arrangements from the experiment and simulation may limit the study's ability to fully understand the impact of solder bump patterns on underfill flow. Therefore, more parameters can be investigated such as solder bump pattern, underfill weight and dispense pattern in the future using CFD. Practical implications: The manuscript provides a comprehensive examination of the contributions of CFD to the advancement of knowledge regarding CUF phenomena in heterogeneous electronic packaging assemblies. Moreover, it delineates the utilization of CFD methodologies to assess the influence of chip-to-chip spacing (S12) and the thickness of the chip (tc) on the underfill flow characteristics. Originality/value: This paper fulfills an identified need of computational fluid dynamics method to study capillary underfill flow dynamics in heterogenous electronic packaging. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Soldering & Surface Mount Technology is the property of Emerald Publishing Limited and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1108/SSMT-05-2024-0022
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 16
        StartPage: 1
    Subjects:
      – SubjectFull: Computational fluid dynamics
        Type: general
      – SubjectFull: Capillary flow
        Type: general
      – SubjectFull: Properties of fluids
        Type: general
      – SubjectFull: Electronic packaging
        Type: general
      – SubjectFull: Non-Newtonian fluids
        Type: general
    Titles:
      – TitleFull: Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Azman, Muhammad Aqil
      – PersonEntity:
          Name:
            NameFull: Abdullah, Mz
      – PersonEntity:
          Name:
            NameFull: Loh, Wei Keat
      – PersonEntity:
          Name:
            NameFull: Ooi, Chun Keang
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: 2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 09540911
          Numbering:
            – Type: volume
              Value: 37
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Soldering & Surface Mount Technology
              Type: main
ResultId 1