An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect.
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| Title: | An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect. |
|---|---|
| Authors: | Lee, Jong-Hyup1 (AUTHOR) 20225308@student.anu.ac.kr, Ham, Ju-Been1 (AUTHOR), Kim, Young-Cheon1 (AUTHOR) kimyc@anu.ac.kr |
| Source: | Materials (1996-1944). Jan2025, Vol. 18 Issue 1, p154. 13p. |
| Subjects: | Substrates (Materials science), Reliability of electronics, Metallic films, Finite element method, Stress concentration |
| Abstract: | The accurate measurement of the elastic modulus of thin metal films on flexible substrates is critical for understanding the mechanical reliability of flexible electronics. However, conventional methods, such as the Oliver–Pharr model, often underestimate the modulus due to substrate effects, particularly with low-modulus substrates like polyimide (PI). In this study, we propose an improved weighting model that replaces the empirical weighting factor with a variable X to better account for substrate contributions. Nanoindentation experiments were performed on Cu and Al films with thicknesses of 0.5, 1, and 1.5 μm, deposited on PI and silicon substrates. The results show a significant underestimation of the elastic modulus when traditional methods were applied, especially on PI substrates, where values decreased by up to 95%. Using the proposed X-based model, the corrected elastic modulus aligned with the inherent properties of the films, with errors reduced to within 2%. A finite element analysis (FEA) validated the stress and displacement distributions, demonstrating the substrate's influence on indentation behavior. This study provides a robust framework for accurately measuring the elastic modulus of thin films on flexible substrates, paving the way for a more reliable mechanical characterization in flexible electronics. [ABSTRACT FROM AUTHOR] |
| Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 182442915 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Lee%2C+Jong-Hyup%22">Lee, Jong-Hyup</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> 20225308@student.anu.ac.kr</i><br /><searchLink fieldCode="AR" term="%22Ham%2C+Ju-Been%22">Ham, Ju-Been</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Kim%2C+Young-Cheon%22">Kim, Young-Cheon</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> kimyc@anu.ac.kr</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Materials+%281996-1944%29%22">Materials (1996-1944)</searchLink>. Jan2025, Vol. 18 Issue 1, p154. 13p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Substrates+%28Materials+science%29%22">Substrates (Materials science)</searchLink><br /><searchLink fieldCode="DE" term="%22Reliability+of+electronics%22">Reliability of electronics</searchLink><br /><searchLink fieldCode="DE" term="%22Metallic+films%22">Metallic films</searchLink><br /><searchLink fieldCode="DE" term="%22Finite+element+method%22">Finite element method</searchLink><br /><searchLink fieldCode="DE" term="%22Stress+concentration%22">Stress concentration</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: The accurate measurement of the elastic modulus of thin metal films on flexible substrates is critical for understanding the mechanical reliability of flexible electronics. However, conventional methods, such as the Oliver–Pharr model, often underestimate the modulus due to substrate effects, particularly with low-modulus substrates like polyimide (PI). In this study, we propose an improved weighting model that replaces the empirical weighting factor with a variable X to better account for substrate contributions. Nanoindentation experiments were performed on Cu and Al films with thicknesses of 0.5, 1, and 1.5 μm, deposited on PI and silicon substrates. The results show a significant underestimation of the elastic modulus when traditional methods were applied, especially on PI substrates, where values decreased by up to 95%. Using the proposed X-based model, the corrected elastic modulus aligned with the inherent properties of the films, with errors reduced to within 2%. A finite element analysis (FEA) validated the stress and displacement distributions, demonstrating the substrate's influence on indentation behavior. This study provides a robust framework for accurately measuring the elastic modulus of thin films on flexible substrates, paving the way for a more reliable mechanical characterization in flexible electronics. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Materials (1996-1944) is the property of MDPI and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=182442915 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.3390/ma18010154 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 13 StartPage: 154 Subjects: – SubjectFull: Substrates (Materials science) Type: general – SubjectFull: Reliability of electronics Type: general – SubjectFull: Metallic films Type: general – SubjectFull: Finite element method Type: general – SubjectFull: Stress concentration Type: general Titles: – TitleFull: An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Lee, Jong-Hyup – PersonEntity: Name: NameFull: Ham, Ju-Been – PersonEntity: Name: NameFull: Kim, Young-Cheon IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 01 Text: Jan2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 19961944 Numbering: – Type: volume Value: 18 – Type: issue Value: 1 Titles: – TitleFull: Materials (1996-1944) Type: main |
| ResultId | 1 |
