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Wear behavior and material removal mechanism during ultrasonic vibration-assisted grinding γ-TiAl materials using a single CBN grain.

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Title: Wear behavior and material removal mechanism during ultrasonic vibration-assisted grinding γ-TiAl materials using a single CBN grain.
Authors: Wang, Xiaowei1 (AUTHOR), Song, Jiahao1 (AUTHOR), Xiao, Hong2 (AUTHOR), Liang, Zhongwei3 (AUTHOR), Qin, Xiaojie4 (AUTHOR), Chen, Tao1 (AUTHOR), Ding, Wenfeng1 (AUTHOR), Zhao, Biao1 (AUTHOR) zhaobiao@nuaa.edu.cn
Source: International Journal of Advanced Manufacturing Technology. Mar2025, Vol. 137 Issue 3, p1581-1598. 18p.
Subjects: Boron nitride, Tangential force, Fracture toughness, Ultrasonics, Ductility
Abstract: Gamma titanium-aluminum intermetallic compounds demonstrate significant potential for application expansion in aerospace engines due to its superior properties. However, it belongs to difficult-to-cut materials owing to the poor ductility and fracture toughness, presenting significant challenges during grinding processes. The current paper proposes ultrasonic vibration-assisted grinding methods with a single cubic boron nitride grain to reveal the wear behavior and material removal mechanism. Characterizations with average volume pile-up ratio, grinding force, and scratches evolution under different grinding speeds, maximum undeformed chip thicknesses, and ultrasonic amplitudes are conducted. The study shows that compared to CG, the UVAG can reduce the normal grinding force of a single grain by 7.2 to 29.7%, the tangential grinding force by 5.7 to 34.4%, and the average volume pile ratio by approximately 39.3%. The frequent contact of the grains on the workpiece during UVAG results in alternating loads, inducing micro-fracture behavior and ensuring a prolonged high level of cutting edges. The surface quality of the scratches under UVAG is improved due to the simultaneous removal of material by a large number of micro-cutting edges. [ABSTRACT FROM AUTHOR]
Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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  Data: Wear behavior and material removal mechanism during ultrasonic vibration-assisted grinding γ-TiAl materials using a single CBN grain.
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  Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Mar2025, Vol. 137 Issue 3, p1581-1598. 18p.
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  Data: <searchLink fieldCode="DE" term="%22Boron+nitride%22">Boron nitride</searchLink><br /><searchLink fieldCode="DE" term="%22Tangential+force%22">Tangential force</searchLink><br /><searchLink fieldCode="DE" term="%22Fracture+toughness%22">Fracture toughness</searchLink><br /><searchLink fieldCode="DE" term="%22Ultrasonics%22">Ultrasonics</searchLink><br /><searchLink fieldCode="DE" term="%22Ductility%22">Ductility</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Gamma titanium-aluminum intermetallic compounds demonstrate significant potential for application expansion in aerospace engines due to its superior properties. However, it belongs to difficult-to-cut materials owing to the poor ductility and fracture toughness, presenting significant challenges during grinding processes. The current paper proposes ultrasonic vibration-assisted grinding methods with a single cubic boron nitride grain to reveal the wear behavior and material removal mechanism. Characterizations with average volume pile-up ratio, grinding force, and scratches evolution under different grinding speeds, maximum undeformed chip thicknesses, and ultrasonic amplitudes are conducted. The study shows that compared to CG, the UVAG can reduce the normal grinding force of a single grain by 7.2 to 29.7%, the tangential grinding force by 5.7 to 34.4%, and the average volume pile ratio by approximately 39.3%. The frequent contact of the grains on the workpiece during UVAG results in alternating loads, inducing micro-fracture behavior and ensuring a prolonged high level of cutting edges. The surface quality of the scratches under UVAG is improved due to the simultaneous removal of material by a large number of micro-cutting edges. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – SubjectFull: Fracture toughness
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              Text: Mar2025
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