Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling.
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| Title: | Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling. |
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| Authors: | Long, Zhang1,2 (AUTHOR), Hao, Guo2 (AUTHOR), Xuemei, Duan2 (AUTHOR), Limeng, Yin1 (AUTHOR) ylmcqust@163.com |
| Source: | Journal of Adhesion Science & Technology. Mar2025, Vol. 39 Issue 6, p922-942. 21p. |
| Subjects: | Solder joints, Microevolution, Intermetallic compounds, Damage models, Copper, Solder & soldering |
| Abstract: | Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas. [ABSTRACT FROM AUTHOR] |
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| Database: | Engineering Source |
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| Abstract: | Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas. [ABSTRACT FROM AUTHOR] |
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| ISSN: | 01694243 |
| DOI: | 10.1080/01694243.2024.2433118 |
