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Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling.

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Title: Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling.
Authors: Long, Zhang1,2 (AUTHOR), Hao, Guo2 (AUTHOR), Xuemei, Duan2 (AUTHOR), Limeng, Yin1 (AUTHOR) ylmcqust@163.com
Source: Journal of Adhesion Science & Technology. Mar2025, Vol. 39 Issue 6, p922-942. 21p.
Subjects: Solder joints, Microevolution, Intermetallic compounds, Damage models, Copper, Solder & soldering
Abstract: Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas. [ABSTRACT FROM AUTHOR]
Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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DbLabel: Engineering Source
An: 183842292
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PubTypeId: academicJournal
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  Label: Title
  Group: Ti
  Data: Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling.
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  Data: <searchLink fieldCode="AR" term="%22Long%2C+Zhang%22">Long, Zhang</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Hao%2C+Guo%22">Hao, Guo</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xuemei%2C+Duan%22">Xuemei, Duan</searchLink><relatesTo>2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Limeng%2C+Yin%22">Limeng, Yin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> ylmcqust@163.com</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Adhesion+Science+%26+Technology%22">Journal of Adhesion Science & Technology</searchLink>. Mar2025, Vol. 39 Issue 6, p922-942. 21p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Solder+joints%22">Solder joints</searchLink><br /><searchLink fieldCode="DE" term="%22Microevolution%22">Microevolution</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Damage+models%22">Damage models</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Solder+%26+soldering%22">Solder & soldering</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: Elevated concentrations of intermetallic compounds (IMC) in micro-solder joints adversely affect their mechanical properties. To elucidate damage evolution trends in these joints with varying IMC thicknesses under multi-field coupling, an initial IMC evolution model was formulated by employing the phase-field method. By adjusting current densities, models with diverse IMC thicknesses were generated. Experimental investigations, including IMC evolution analysis and tensile testing, determined critical damage parameters, enabling the formulation of a scalar damage model specific to micro-solder joints. Statistical analysis revealed that as IMC thickness increased, anodic damage remained confined within the IMC layer, while cathodic damage transitioned from the IMC layer to the IMC-Sn solder interface, ultimately damaging the Sn solder layer. Additionally, thicker IMC micro-solder joint models exhibited damage at lower separation displacements and encompassed larger damage areas. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of Adhesion Science & Technology is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1080/01694243.2024.2433118
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 21
        StartPage: 922
    Subjects:
      – SubjectFull: Solder joints
        Type: general
      – SubjectFull: Microevolution
        Type: general
      – SubjectFull: Intermetallic compounds
        Type: general
      – SubjectFull: Damage models
        Type: general
      – SubjectFull: Copper
        Type: general
      – SubjectFull: Solder & soldering
        Type: general
    Titles:
      – TitleFull: Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling.
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            NameFull: Long, Zhang
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            NameFull: Hao, Guo
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            NameFull: Xuemei, Duan
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            NameFull: Limeng, Yin
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            – D: 15
              M: 03
              Text: Mar2025
              Type: published
              Y: 2025
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            – TitleFull: Journal of Adhesion Science & Technology
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