APA (7th ed.) Citation

Li, H., Gao, Y., Cheng, D., & Yang, C. (2025). Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode. International Journal of Advanced Manufacturing Technology, 138(2), 471. https://doi.org/10.1007/s00170-025-15542-7

Chicago Style (17th ed.) Citation

Li, Honghao, Yufei Gao, Dameng Cheng, and Chunfeng Yang. "Modeling and Experimental Investigation on Sawing Force in Ultrasonic Vibration–assisted Diamond Wire Sawing Mono-Si Considering Material Removal Mode." International Journal of Advanced Manufacturing Technology 138, no. 2 (2025): 471. https://doi.org/10.1007/s00170-025-15542-7.

MLA (9th ed.) Citation

Li, Honghao, et al. "Modeling and Experimental Investigation on Sawing Force in Ultrasonic Vibration–assisted Diamond Wire Sawing Mono-Si Considering Material Removal Mode." International Journal of Advanced Manufacturing Technology, vol. 138, no. 2, 2025, p. 471, https://doi.org/10.1007/s00170-025-15542-7.