Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode.
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| Title: | Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode. |
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| Authors: | Li, Honghao1 (AUTHOR), Gao, Yufei1,2,3 (AUTHOR) yfgao@sdu.edu.cn, Cheng, Dameng1 (AUTHOR), Yang, Chunfeng1 (AUTHOR) |
| Source: | International Journal of Advanced Manufacturing Technology. May2025, Vol. 138 Issue 2, p471-489. 19p. |
| Subjects: | Sawing, Tangential force, Micromechanics, Abrasives, Critical analysis |
| Abstract: | Monocrystalline silicon (mono-Si) is widely used in many fields due to its excellent properties. In recent years, with the continuous improvement of the quality requirements for mono-Si cutting, the ultrasonic-assisted diamond wire sawing (UADWS) has gradually developed. As a crucial factor affecting the machining quality, it is of great significance to accurately predict the sawing force. In this paper, based on the analysis of the critical cutting depth for brittle-to-ductile transition, abrasive trajectory, micro-mechanics of abrasives, and material removal volume, the force model for material removal by single abrasive in both brittle and ductile modes were established respectively. According to the distribution of abrasives on the surface of wire saw, the theoretical model of UADWS sawing force based on material brittle-ductile removal mode was constructed. The experiment of sawing mono-Si by UADWS was carried out, and the sawing force in the machining process was measured. The theoretical model was verified, and the influence of processing parameters on the sawing force was analyzed. The results show that the relative error between the theoretical and experimental results of normal force and tangential force is less than 12.13% and 16.67% respectively, which verifies the validity of the theoretical model. The sawing force increases with the increase of feed speed and decreases with the increase of wire speed and ultrasonic amplitude. The research results provide a reference for predicting sawing force and optimizing processing parameters in UADWS technology. [ABSTRACT FROM AUTHOR] |
| Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
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| Header | DbId: egs DbLabel: Engineering Source An: 184826485 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Li%2C+Honghao%22">Li, Honghao</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Gao%2C+Yufei%22">Gao, Yufei</searchLink><relatesTo>1,2,3</relatesTo> (AUTHOR)<i> yfgao@sdu.edu.cn</i><br /><searchLink fieldCode="AR" term="%22Cheng%2C+Dameng%22">Cheng, Dameng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yang%2C+Chunfeng%22">Yang, Chunfeng</searchLink><relatesTo>1</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. May2025, Vol. 138 Issue 2, p471-489. 19p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Sawing%22">Sawing</searchLink><br /><searchLink fieldCode="DE" term="%22Tangential+force%22">Tangential force</searchLink><br /><searchLink fieldCode="DE" term="%22Micromechanics%22">Micromechanics</searchLink><br /><searchLink fieldCode="DE" term="%22Abrasives%22">Abrasives</searchLink><br /><searchLink fieldCode="DE" term="%22Critical+analysis%22">Critical analysis</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: Monocrystalline silicon (mono-Si) is widely used in many fields due to its excellent properties. In recent years, with the continuous improvement of the quality requirements for mono-Si cutting, the ultrasonic-assisted diamond wire sawing (UADWS) has gradually developed. As a crucial factor affecting the machining quality, it is of great significance to accurately predict the sawing force. In this paper, based on the analysis of the critical cutting depth for brittle-to-ductile transition, abrasive trajectory, micro-mechanics of abrasives, and material removal volume, the force model for material removal by single abrasive in both brittle and ductile modes were established respectively. According to the distribution of abrasives on the surface of wire saw, the theoretical model of UADWS sawing force based on material brittle-ductile removal mode was constructed. The experiment of sawing mono-Si by UADWS was carried out, and the sawing force in the machining process was measured. The theoretical model was verified, and the influence of processing parameters on the sawing force was analyzed. The results show that the relative error between the theoretical and experimental results of normal force and tangential force is less than 12.13% and 16.67% respectively, which verifies the validity of the theoretical model. The sawing force increases with the increase of feed speed and decreases with the increase of wire speed and ultrasonic amplitude. The research results provide a reference for predicting sawing force and optimizing processing parameters in UADWS technology. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s00170-025-15542-7 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 19 StartPage: 471 Subjects: – SubjectFull: Sawing Type: general – SubjectFull: Tangential force Type: general – SubjectFull: Micromechanics Type: general – SubjectFull: Abrasives Type: general – SubjectFull: Critical analysis Type: general Titles: – TitleFull: Modeling and experimental investigation on sawing force in ultrasonic vibration–assisted diamond wire sawing mono-Si considering material removal mode. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Li, Honghao – PersonEntity: Name: NameFull: Gao, Yufei – PersonEntity: Name: NameFull: Cheng, Dameng – PersonEntity: Name: NameFull: Yang, Chunfeng IsPartOfRelationships: – BibEntity: Dates: – D: 11 M: 05 Text: May2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 02683768 Numbering: – Type: volume Value: 138 – Type: issue Value: 2 Titles: – TitleFull: International Journal of Advanced Manufacturing Technology Type: main |
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