View in EDS HTML Full Text PDF Full Text

Electrical percolation and mechanical properties of Si3N4–TiC0.5N0.5 composite ceramics.

Saved in:
Bibliographic Details
Title: Electrical percolation and mechanical properties of Si3N4–TiC0.5N0.5 composite ceramics.
Authors: Zhu, Ming1 (AUTHOR), Xia, Yongfeng1 (AUTHOR), Yao, Dongxu1 (AUTHOR), Zhao, Jun1 (AUTHOR), Zeng, Yu‐Ping1 (AUTHOR) yuping-zeng@mail.sic.ac.cn
Source: Journal of the American Ceramic Society. Jul2025, Vol. 108 Issue 7, p1-9. 9p.
Subjects: Elastic modulus, Functional integration, Fracture toughness, Light sources, Flexural strength, Hot pressing
Abstract: In recent years, the application of Si3N4 ceramics has been developing in the direction of structural and functional integration. In this work, highly densified Si3N4–TiC0.5N0.5 composites were fabricated by hot pressing with Y2O3–MgO sintering additives, and the effects of TiC0.5N0.5 content on phase composition, microstructure, mechanical properties, and electrical properties were studied. When the content was higher than 20 vol%, the TiC0.5N0.5 conductive network was constructed. The resistivity decreased with the increase of TiC0.5N0.5 content, and the percolation threshold was 20 vol%, where the resistivity dropped sharply by six orders of magnitude. The addition of TiC0.5N0.5 with PTC characteristic neutralized the temperature sensitivity of the resistivity of Si3N4 ceramic with NTC characteristic. Si3N4–30vol%TiC0.5N0.5 composites showed good electrical conductivity, as well as good temperature resistance stability characteristic at RT–400°C with a resistivity of 15.5 ± 2.4 Ω cm. The Si3N4–TiC0.5N0.5 composites showed relatively high mechanical properties, the flexural strength, elastic modulus, fracture toughness, and hardness of Si3N4–30vol%TiC0.5N0.5 composites were 750 MPa, 340 GPa, 6.94 MPa m1/2, and 14.8 GPa, respectively. The Si3N4‐based ceramics with integrated structural and functional properties have been obtained in this work, which is expected to be applied to sophisticated electrical devices such as electrostatic chuck, wafer heater, and infrared light source. [ABSTRACT FROM AUTHOR]
Copyright of Journal of the American Ceramic Society is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
Database: Engineering Source
Full text is not displayed to guests.
FullText Links:
  – Type: pdflink
Text:
  Availability: 1
Header DbId: egs
DbLabel: Engineering Source
An: 184927817
AccessLevel: 6
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
IllustrationInfo
Items – Name: Title
  Label: Title
  Group: Ti
  Data: Electrical percolation and mechanical properties of Si<subscript>3</subscript>N<subscript>4</subscript>–TiC<subscript>0.5</subscript>N<subscript>0.5</subscript> composite ceramics.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Zhu%2C+Ming%22">Zhu, Ming</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Xia%2C+Yongfeng%22">Xia, Yongfeng</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Yao%2C+Dongxu%22">Yao, Dongxu</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zhao%2C+Jun%22">Zhao, Jun</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Zeng%2C+Yu‐Ping%22">Zeng, Yu‐Ping</searchLink><relatesTo>1</relatesTo> (AUTHOR)<i> yuping-zeng@mail.sic.ac.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+the+American+Ceramic+Society%22">Journal of the American Ceramic Society</searchLink>. Jul2025, Vol. 108 Issue 7, p1-9. 9p.
– Name: Subject
  Label: Subjects
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22Elastic+modulus%22">Elastic modulus</searchLink><br /><searchLink fieldCode="DE" term="%22Functional+integration%22">Functional integration</searchLink><br /><searchLink fieldCode="DE" term="%22Fracture+toughness%22">Fracture toughness</searchLink><br /><searchLink fieldCode="DE" term="%22Light+sources%22">Light sources</searchLink><br /><searchLink fieldCode="DE" term="%22Flexural+strength%22">Flexural strength</searchLink><br /><searchLink fieldCode="DE" term="%22Hot+pressing%22">Hot pressing</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: In recent years, the application of Si3N4 ceramics has been developing in the direction of structural and functional integration. In this work, highly densified Si3N4–TiC0.5N0.5 composites were fabricated by hot pressing with Y2O3–MgO sintering additives, and the effects of TiC0.5N0.5 content on phase composition, microstructure, mechanical properties, and electrical properties were studied. When the content was higher than 20 vol%, the TiC0.5N0.5 conductive network was constructed. The resistivity decreased with the increase of TiC0.5N0.5 content, and the percolation threshold was 20 vol%, where the resistivity dropped sharply by six orders of magnitude. The addition of TiC0.5N0.5 with PTC characteristic neutralized the temperature sensitivity of the resistivity of Si3N4 ceramic with NTC characteristic. Si3N4–30vol%TiC0.5N0.5 composites showed good electrical conductivity, as well as good temperature resistance stability characteristic at RT–400°C with a resistivity of 15.5 ± 2.4 Ω cm. The Si3N4–TiC0.5N0.5 composites showed relatively high mechanical properties, the flexural strength, elastic modulus, fracture toughness, and hardness of Si3N4–30vol%TiC0.5N0.5 composites were 750 MPa, 340 GPa, 6.94 MPa m1/2, and 14.8 GPa, respectively. The Si3N4‐based ceramics with integrated structural and functional properties have been obtained in this work, which is expected to be applied to sophisticated electrical devices such as electrostatic chuck, wafer heater, and infrared light source. [ABSTRACT FROM AUTHOR]
– Name: AbstractSuppliedCopyright
  Label:
  Group: Ab
  Data: <i>Copyright of Journal of the American Ceramic Society is the property of Wiley-Blackwell and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=egs&AN=184927817
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1111/jace.20472
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 9
        StartPage: 1
    Subjects:
      – SubjectFull: Elastic modulus
        Type: general
      – SubjectFull: Functional integration
        Type: general
      – SubjectFull: Fracture toughness
        Type: general
      – SubjectFull: Light sources
        Type: general
      – SubjectFull: Flexural strength
        Type: general
      – SubjectFull: Hot pressing
        Type: general
    Titles:
      – TitleFull: Electrical percolation and mechanical properties of Si3N4–TiC0.5N0.5 composite ceramics.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhu, Ming
      – PersonEntity:
          Name:
            NameFull: Xia, Yongfeng
      – PersonEntity:
          Name:
            NameFull: Yao, Dongxu
      – PersonEntity:
          Name:
            NameFull: Zhao, Jun
      – PersonEntity:
          Name:
            NameFull: Zeng, Yu‐Ping
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 07
              Text: Jul2025
              Type: published
              Y: 2025
          Identifiers:
            – Type: issn-print
              Value: 00027820
          Numbering:
            – Type: volume
              Value: 108
            – Type: issue
              Value: 7
          Titles:
            – TitleFull: Journal of the American Ceramic Society
              Type: main
ResultId 1