Quantile regression-enriched event modeling framework for dropout analysis in high-temperature superconductor manufacturing.
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| Title: | Quantile regression-enriched event modeling framework for dropout analysis in high-temperature superconductor manufacturing. |
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| Authors: | Li, Mai1 (AUTHOR), Lin, Ying1,2 (AUTHOR) ylin58@uh.edu, Feng, Qianmei1,2 (AUTHOR), Fu, Wenjiang2,3 (AUTHOR), Peng, Shenglin1 (AUTHOR), Chen, Siwei4 (AUTHOR), Paidpilli, Mahesh2,5,6 (AUTHOR), Goel, Chirag2,5,6 (AUTHOR), Galstyan, Eduard2,5,6 (AUTHOR), Selvamanickam, Venkat2,5,6 (AUTHOR) |
| Source: | Journal of Intelligent Manufacturing. Jun2025, Vol. 36 Issue 5, p3009-3030. 22p. |
| Subjects: | High temperature superconductors, Critical currents, Poisson processes, Manufacturing processes, Feature selection |
| Abstract: | High-temperature superconductor (HTS) tapes have shown promising characteristics of high critical current, which are prerequisites for applications in high-field magnets. Due to the unstable growth conditions in the HTS manufacturing process, however, the frequent occurrences of dropouts in the critical current impede the consistent performance of HTS tapes. To manufacture HTS tapes with large scale, high yield, and uniform performance, it is essential to develop novel data analysis approaches for modeling the dropouts and identifying the related important process parameters. Conventional methods for modeling recurrent events, such as the point process, require the extraction of events from quality measurements. As the critical current is a continuous process, it may not comprehensively represent the drop patterns by transforming the time-series measurements into a set of events. To solve this issue, we develop a novel quantile regression-enriched event modeling (QREM) framework that integrates the non-homogeneous Poisson process for modeling the occurrence of dropouts and the quantile regression for capturing the drop patterns. By incorporating the feature selection and regularization, the proposed framework identifies a set of significant process parameters that can potentially cause the dropouts of HTS tapes. The proposed method is tested on real HTS tapes produced using an advanced manufacturing process, successfully identifying important parameters that influence dropout events including the substrate temperature and voltage. The results demonstrate that the proposed QREM method outperforms the standard point process in predicting the occurrence of dropouts. [ABSTRACT FROM AUTHOR] |
| Copyright of Journal of Intelligent Manufacturing is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 185281389 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Quantile regression-enriched event modeling framework for dropout analysis in high-temperature superconductor manufacturing. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Li%2C+Mai%22">Li, Mai</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Lin%2C+Ying%22">Lin, Ying</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> ylin58@uh.edu</i><br /><searchLink fieldCode="AR" term="%22Feng%2C+Qianmei%22">Feng, Qianmei</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Fu%2C+Wenjiang%22">Fu, Wenjiang</searchLink><relatesTo>2,3</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Peng%2C+Shenglin%22">Peng, Shenglin</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chen%2C+Siwei%22">Chen, Siwei</searchLink><relatesTo>4</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Paidpilli%2C+Mahesh%22">Paidpilli, Mahesh</searchLink><relatesTo>2,5,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Goel%2C+Chirag%22">Goel, Chirag</searchLink><relatesTo>2,5,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Galstyan%2C+Eduard%22">Galstyan, Eduard</searchLink><relatesTo>2,5,6</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Selvamanickam%2C+Venkat%22">Selvamanickam, Venkat</searchLink><relatesTo>2,5,6</relatesTo> (AUTHOR) – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Journal+of+Intelligent+Manufacturing%22">Journal of Intelligent Manufacturing</searchLink>. Jun2025, Vol. 36 Issue 5, p3009-3030. 22p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22High+temperature+superconductors%22">High temperature superconductors</searchLink><br /><searchLink fieldCode="DE" term="%22Critical+currents%22">Critical currents</searchLink><br /><searchLink fieldCode="DE" term="%22Poisson+processes%22">Poisson processes</searchLink><br /><searchLink fieldCode="DE" term="%22Manufacturing+processes%22">Manufacturing processes</searchLink><br /><searchLink fieldCode="DE" term="%22Feature+selection%22">Feature selection</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: High-temperature superconductor (HTS) tapes have shown promising characteristics of high critical current, which are prerequisites for applications in high-field magnets. Due to the unstable growth conditions in the HTS manufacturing process, however, the frequent occurrences of dropouts in the critical current impede the consistent performance of HTS tapes. To manufacture HTS tapes with large scale, high yield, and uniform performance, it is essential to develop novel data analysis approaches for modeling the dropouts and identifying the related important process parameters. Conventional methods for modeling recurrent events, such as the point process, require the extraction of events from quality measurements. As the critical current is a continuous process, it may not comprehensively represent the drop patterns by transforming the time-series measurements into a set of events. To solve this issue, we develop a novel quantile regression-enriched event modeling (QREM) framework that integrates the non-homogeneous Poisson process for modeling the occurrence of dropouts and the quantile regression for capturing the drop patterns. By incorporating the feature selection and regularization, the proposed framework identifies a set of significant process parameters that can potentially cause the dropouts of HTS tapes. The proposed method is tested on real HTS tapes produced using an advanced manufacturing process, successfully identifying important parameters that influence dropout events including the substrate temperature and voltage. The results demonstrate that the proposed QREM method outperforms the standard point process in predicting the occurrence of dropouts. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of Journal of Intelligent Manufacturing is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s10845-024-02358-7 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 22 StartPage: 3009 Subjects: – SubjectFull: High temperature superconductors Type: general – SubjectFull: Critical currents Type: general – SubjectFull: Poisson processes Type: general – SubjectFull: Manufacturing processes Type: general – SubjectFull: Feature selection Type: general Titles: – TitleFull: Quantile regression-enriched event modeling framework for dropout analysis in high-temperature superconductor manufacturing. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Li, Mai – PersonEntity: Name: NameFull: Lin, Ying – PersonEntity: Name: NameFull: Feng, Qianmei – PersonEntity: Name: NameFull: Fu, Wenjiang – PersonEntity: Name: NameFull: Peng, Shenglin – PersonEntity: Name: NameFull: Chen, Siwei – PersonEntity: Name: NameFull: Paidpilli, Mahesh – PersonEntity: Name: NameFull: Goel, Chirag – PersonEntity: Name: NameFull: Galstyan, Eduard – PersonEntity: Name: NameFull: Selvamanickam, Venkat IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 06 Text: Jun2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 09565515 Numbering: – Type: volume Value: 36 – Type: issue Value: 5 Titles: – TitleFull: Journal of Intelligent Manufacturing Type: main |
| ResultId | 1 |