APA (7th ed.) Citation

Cheng, Y., Wen, C., & Chuang, C. (2025). Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits. International Journal of Advanced Manufacturing Technology, 138(9), 4661. https://doi.org/10.1007/s00170-025-15814-2

Chicago Style (17th ed.) Citation

Cheng, Yu-Chi, Chih-Ying Wen, and Cheng-Li Chuang. "Investigation of Ultrasonic Joining Parameters Affecting the Joining Quality of Cu Wire to Cu Pads in Lithium Battery Electrical Circuits." International Journal of Advanced Manufacturing Technology 138, no. 9 (2025): 4661. https://doi.org/10.1007/s00170-025-15814-2.

MLA (9th ed.) Citation

Cheng, Yu-Chi, et al. "Investigation of Ultrasonic Joining Parameters Affecting the Joining Quality of Cu Wire to Cu Pads in Lithium Battery Electrical Circuits." International Journal of Advanced Manufacturing Technology, vol. 138, no. 9, 2025, p. 4661, https://doi.org/10.1007/s00170-025-15814-2.