Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits.
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| Title: | Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits. |
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| Authors: | Cheng, Yu-Chi1,2 (AUTHOR), Wen, Chih-Ying1 (AUTHOR), Chuang, Cheng-Li1,2 (AUTHOR) luke@csmu.edu.tw |
| Source: | International Journal of Advanced Manufacturing Technology. Jun2025, Vol. 138 Issue 9, p4661-4673. 13p. |
| Subjects: | Copper wire, Intermetallic compounds, Electric circuits, Copper, Electric batteries |
| Abstract: | To improve the cruising range of electric vehicles (EVs), lithium-ion cells are assembled into modules that require efficient electrical circuits for power delivery. In fusion-based joining techniques, achieving a sufficiently high interfacial temperature is crucial to forming a robust joint between electrical wires and bond pads. However, such processes can lead to defects such as voids, cracks, segregation, or intermetallic compounds within the joint, which can compromise reliability and significantly shorten service life. Ultrasonic joining is a promising method for joining copper wires to copper pads, enabling reliable joints with sufficient strength at room temperature. As ultrasonic power and joining time increase, the resulting energy raises the interface temperature, enhances atomic interdiffusion, and strengthens the joint. However, excessive ultrasonic power (45 W) can cause over-deformation, material overflow, and thinning of the joint, ultimately reducing joint strength. Likewise, an excessively high joining load (270 N) suppresses ultrasonic energy transmission and limits interfacial motion and heating, thereby hindering atomic interdiffusion and resulting in unjoined regions that weaken the joint. Experimental results demonstrate that adequate parameters—28 W ultrasonic power, 0.3 s joining time, and 108 N joining load—produce strong and reliable copper joints. This study successfully demonstrates the feasibility of ultrasonic joining of copper wires to bond pads at room temperature, highlighting its potential for application in the electrical circuits of lithium-ion battery modules. [ABSTRACT FROM AUTHOR] |
| Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.) | |
| Database: | Engineering Source |
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| Header | DbId: egs DbLabel: Engineering Source An: 185941516 AccessLevel: 6 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AR" term="%22Cheng%2C+Yu-Chi%22">Cheng, Yu-Chi</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Wen%2C+Chih-Ying%22">Wen, Chih-Ying</searchLink><relatesTo>1</relatesTo> (AUTHOR)<br /><searchLink fieldCode="AR" term="%22Chuang%2C+Cheng-Li%22">Chuang, Cheng-Li</searchLink><relatesTo>1,2</relatesTo> (AUTHOR)<i> luke@csmu.edu.tw</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22International+Journal+of+Advanced+Manufacturing+Technology%22">International Journal of Advanced Manufacturing Technology</searchLink>. Jun2025, Vol. 138 Issue 9, p4661-4673. 13p. – Name: Subject Label: Subjects Group: Su Data: <searchLink fieldCode="DE" term="%22Copper+wire%22">Copper wire</searchLink><br /><searchLink fieldCode="DE" term="%22Intermetallic+compounds%22">Intermetallic compounds</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+circuits%22">Electric circuits</searchLink><br /><searchLink fieldCode="DE" term="%22Copper%22">Copper</searchLink><br /><searchLink fieldCode="DE" term="%22Electric+batteries%22">Electric batteries</searchLink> – Name: Abstract Label: Abstract Group: Ab Data: To improve the cruising range of electric vehicles (EVs), lithium-ion cells are assembled into modules that require efficient electrical circuits for power delivery. In fusion-based joining techniques, achieving a sufficiently high interfacial temperature is crucial to forming a robust joint between electrical wires and bond pads. However, such processes can lead to defects such as voids, cracks, segregation, or intermetallic compounds within the joint, which can compromise reliability and significantly shorten service life. Ultrasonic joining is a promising method for joining copper wires to copper pads, enabling reliable joints with sufficient strength at room temperature. As ultrasonic power and joining time increase, the resulting energy raises the interface temperature, enhances atomic interdiffusion, and strengthens the joint. However, excessive ultrasonic power (45 W) can cause over-deformation, material overflow, and thinning of the joint, ultimately reducing joint strength. Likewise, an excessively high joining load (270 N) suppresses ultrasonic energy transmission and limits interfacial motion and heating, thereby hindering atomic interdiffusion and resulting in unjoined regions that weaken the joint. Experimental results demonstrate that adequate parameters—28 W ultrasonic power, 0.3 s joining time, and 108 N joining load—produce strong and reliable copper joints. This study successfully demonstrates the feasibility of ultrasonic joining of copper wires to bond pads at room temperature, highlighting its potential for application in the electrical circuits of lithium-ion battery modules. [ABSTRACT FROM AUTHOR] – Name: AbstractSuppliedCopyright Label: Group: Ab Data: <i>Copyright of International Journal of Advanced Manufacturing Technology is the property of Springer Nature and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.) |
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| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1007/s00170-025-15814-2 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 13 StartPage: 4661 Subjects: – SubjectFull: Copper wire Type: general – SubjectFull: Intermetallic compounds Type: general – SubjectFull: Electric circuits Type: general – SubjectFull: Copper Type: general – SubjectFull: Electric batteries Type: general Titles: – TitleFull: Investigation of ultrasonic joining parameters affecting the joining quality of Cu wire to Cu pads in lithium battery electrical circuits. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Cheng, Yu-Chi – PersonEntity: Name: NameFull: Wen, Chih-Ying – PersonEntity: Name: NameFull: Chuang, Cheng-Li IsPartOfRelationships: – BibEntity: Dates: – D: 21 M: 06 Text: Jun2025 Type: published Y: 2025 Identifiers: – Type: issn-print Value: 02683768 Numbering: – Type: volume Value: 138 – Type: issue Value: 9 Titles: – TitleFull: International Journal of Advanced Manufacturing Technology Type: main |
| ResultId | 1 |
