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CHIPcon 2025.

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Bibliographic Details
Title: CHIPcon 2025.
Source: Advancing Microelectronics. 2025, Vol. 52 Issue 3, p26-36. 11p.
Subjects: Wafer level packaging, Career development, Generative artificial intelligence, Thermal interface materials, Language models, Flip chip technology, Systems on a chip, Edge computing
Database: Engineering Source
Description
ISSN:23807008